SAE International Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled AMS3684C

Description
This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.
Description
This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.

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Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled - AMS3684C - SAE International
Warrendale, PA, United States
Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled
AMS3684C
Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled AMS3684C
This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.

This specification covers a single-component, unfilled, heat-reactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.

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Technical Specifications

  SAE International
Product Category Standards and Technical Documents
Product Number AMS3684C
Product Name Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled
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