SAE International Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates AMS2690C

Description
This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding.
  • Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates - AMS2690C - SAE International
    SAE International
Description
This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding.

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Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates - AMS2690C - SAE International
SAE International
Warrendale, PA, United States
Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates
AMS2690C
Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates AMS2690C
This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding.

This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding.

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Technical Specifications

  SAE International
Product Category Standards and Technical Documents
Product Number AMS2690C
Product Name Parallel Gap Welding Microelectronic Interconnections to Thin Film Substrates
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