ROHM Semiconductor USA, LLC Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers BH76909GU

Description
The BH768??FVM series video drivers integrate all of the same functions in a smaller Chip Sized Package (CSP), contributing to end-product miniaturization. The units feature a built-in charge pump that eliminates the need for a large capacitance output capacitor, an LPF optimized for portable devices, a standby current consumption of 0uA, and the capability to operate from a voltage source as low as 2.5V, making them ideal for high-density applications requiring low power consumption.
Datasheet
Description
The BH768??FVM series video drivers integrate all of the same functions in a smaller Chip Sized Package (CSP), contributing to end-product miniaturization. The units feature a built-in charge pump that eliminates the need for a large capacitance output capacitor, an LPF optimized for portable devices, a standby current consumption of 0uA, and the capability to operate from a voltage source as low as 2.5V, making them ideal for high-density applications requiring low power consumption.
Datasheet

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Ultra-compact Waferlevel chip size package  Output Capacitor-less Video Drivers - BH76909GU - ROHM Semiconductor USA, LLC
Santa Clara, CA, USA
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers
BH76909GU
Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers BH76909GU
The BH768??FVM series video drivers integrate all of the same functions in a smaller Chip Sized Package (CSP), contributing to end-product miniaturization. The units feature a built-in charge pump that eliminates the need for a large capacitance output capacitor, an LPF optimized for portable devices, a standby current consumption of 0uA, and the capability to operate from a voltage source as low as 2.5V, making them ideal for high-density applications requiring low power consumption.

The BH768??FVM series video drivers integrate all of the same functions in a smaller Chip Sized Package (CSP), contributing to end-product miniaturization. The units feature a built-in charge pump that eliminates the need for a large capacitance output capacitor, an LPF optimized for portable devices, a standby current consumption of 0uA, and the capability to operate from a voltage source as low as 2.5V, making them ideal for high-density applications requiring low power consumption.

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Technical Specifications

  ROHM Semiconductor USA, LLC
Product Category Video Processor ICs
Product Number BH76909GU
Product Name Ultra-compact Waferlevel chip size package Output Capacitor-less Video Drivers
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