Rochester Electronics Embedded - Embedded - System On Chip (SoC) - UPD60803F1-A11-BND-E2-A UPD60803F1-A11-BND-E2-A

Description
Manufacturer: Renesas Electronics America Win Source Part Number: 938270-UPD60803F1-A1 1-BND-E2-A Series: * Features: System On Chip (SOC) IC series Package: Bulk Categories: Integrated Circuits (ICs) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 40 pct. Supply and Demand Status: Balance Quantity per package: 2000 MSL Level: 3 (168 Hours) REACH Status: Vendor Undefined HTSUS: 8542.39.0001
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Description
Manufacturer: Renesas Electronics America Win Source Part Number: 938270-UPD60803F1-A1 1-BND-E2-A Series: * Features: System On Chip (SOC) IC series Package: Bulk Categories: Integrated Circuits (ICs) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 40 pct. Supply and Demand Status: Balance Quantity per package: 2000 MSL Level: 3 (168 Hours) REACH Status: Vendor Undefined HTSUS: 8542.39.0001
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Embedded - Embedded - System On Chip (SoC) - UPD60803F1-A11-BND-E2-A - 938270-UPD60803F1-A11-BND-E2-A - Win Source Electronics
Laguna Hills, CA, United States
Embedded - Embedded - System On Chip (SoC) - UPD60803F1-A11-BND-E2-A
938270-UPD60803F1-A11-BND-E2-A
Embedded - Embedded - System On Chip (SoC) - UPD60803F1-A11-BND-E2-A 938270-UPD60803F1-A11-BND-E2-A
Manufacturer: Renesas Electronics America Win Source Part Number: 938270-UPD60803F1-A1 1-BND-E2-A Series: * Features: System On Chip (SOC) IC series Package: Bulk Categories: Integrated Circuits (ICs) ECCN: EAR99 Popularity: High Fake Threat In the Open Market: 40 pct. Supply and Demand Status: Balance Quantity per package: 2000 MSL Level: 3 (168 Hours) REACH Status: Vendor Undefined HTSUS: 8542.39.0001

Manufacturer: Renesas Electronics America
Win Source Part Number: 938270-UPD60803F1-A11-BND-E2-A
Series: *
Features: System On Chip (SOC) IC series
Package: Bulk
Categories: Integrated Circuits (ICs)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 40 pct.
Supply and Demand Status: Balance
Quantity per package: 2000
MSL Level: 3 (168 Hours)
REACH Status: Vendor Undefined
HTSUS: 8542.39.0001

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Embedded - System On Chip (SoC) - UPD60803F1-A11-BND-E2-A - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
UPD60803F1-A11-BND-E2-A
Embedded - System On Chip (SoC) UPD60803F1-A11-BND-E2-A
SOC MEDIA IC

SOC MEDIA IC

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics Lingto Electronic Limited
Product Category System on a Chip (SoC) System on a Chip (SoC)
Product Number 938270-UPD60803F1-A11-BND-E2-A UPD60803F1-A11-BND-E2-A
Product Name Embedded - Embedded - System On Chip (SoC) - UPD60803F1-A11-BND-E2-A Embedded - System On Chip (SoC)
Package / Case Bulk
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