Rochester Electronics Interface - Modems - ICs and Modules HSP303D-TR

Description
CONEXANT HSP30 HSP PCI MODEM IC
Datasheet
Description
CONEXANT HSP30 HSP PCI MODEM IC
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Interface - Modems - ICs and Modules - HSP303D-TR - Lingto Electronic Limited
Shenzhen, China
Interface - Modems - ICs and Modules
HSP303D-TR
Interface - Modems - ICs and Modules HSP303D-TR
CONEXANT HSP30 HSP PCI MODEM IC

CONEXANT HSP30 HSP PCI MODEM IC

Supplier's Site Datasheet

Technical Specifications

  Lingto Electronic Limited
Product Category IC Interfaces
Product Number HSP303D-TR
Product Name Interface - Modems - ICs and Modules
Device Type Sensor Interface
Unlock Full Specs
to access all available technical data

Similar Products

Sensor and Detector Interfaces - A5350CA-T-ND - DigiKey
Specs
Device Type Sensor Interface
Operating Temperature -10 to 60 C (14 to 140 F)
Package Type DIP; "16-DIP (0.300"", 7.62mm)"
View Details
6 suppliers
Bounce Eliminator ICs - 1897454 - RS Components, Ltd.
Specs
Features RoHS
Supply Voltage Other; 5.5 v
Package Type SSOP; Ssop
View Details
Octal buffer/line driver; 3-state - 74AHCT244BQ-Q100/X - Nexperia B.V.
Specs
Device Type Buffer
Features RoHS
Supply Voltage Other; +7.0
View Details
RF Front End (LNA + PA) - 2312-QM55001TR13TR-ND - DigiKey
Specs
Device Type Front End
Package Type 24-WQFN Exposed Pad
Pins 24 #
View Details