Rochester Electronics Memory CY7C1370DV25-200BZC

Description
IC SRAM 18MBIT PARALLEL 165FBGA
  • Memory - CY7C1370DV25-200BZC - Lingto Electronic Limited
    Lingto Electronic Limited
Datasheet
Description
IC SRAM 18MBIT PARALLEL 165FBGA
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - CY7C1370DV25-200BZC - Lingto Electronic Limited
Lingto Electronic Limited
Shenzhen, China
Memory
CY7C1370DV25-200BZC
Memory CY7C1370DV25-200BZC
IC SRAM 18MBIT PARALLEL 165FBGA

IC SRAM 18MBIT PARALLEL 165FBGA

Supplier's Site Datasheet

Technical Specifications

  Lingto Electronic Limited
Product Category Memory Chips
Product Number CY7C1370DV25-200BZC
Product Name Memory
Memory Category SRAM; SRAM Chip
Unlock Full Specs
to access all available technical data

Similar Products

Memory - SMJ44400 - Micross Components, Inc.
Micross Components, Inc.
Memory
SMJ44400
Specs
Memory Category DRAM; DRAM Chip
Access Time 80 to 120 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details
Memory - 8 611 200 861 - Quarktwin Technology Ltd.
Infineon Technologies AG
Memory
8 611 200 861
View Details
2 suppliers
- 27LS00DM/B - Rochester Electronics
Rochester Electronics
Integrated Circuits (ICs) - Memory - Memory
27LS00DM/B
Specs
Memory Category SRAM Chip
Package Type CFP
View Details
4 suppliers
Memory IC and Storage Component - 774-HPA01220DBZR - ERSAELECTRONICS PTE. LTD.
Texas Instruments
Memory IC and Storage Component
HPA01220DBZR
Specs
Operating Temperature -20 C (-4 F)
Density 1 kbits
Pins 3
View Details
5 suppliers