Renesas Electronics Corporation Sensor and Detector Interfaces ZSSC4151CE1D

Description
DICE (WAFER SAWN) - WAFFLE PACK
  • Sensor and Detector Interfaces - ZSSC4151CE1D - Quarktwin Technology Ltd.
    Quarktwin Technology Ltd.
Description
DICE (WAFER SAWN) - WAFFLE PACK

Suppliers

Company
Product
Description
Supplier Links
Sensor and Detector Interfaces - ZSSC4151CE1D - Quarktwin Technology Ltd.
Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Sensor and Detector Interfaces
ZSSC4151CE1D
Sensor and Detector Interfaces ZSSC4151CE1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Buy Now

Technical Specifications

  Quarktwin Technology Ltd.
Product Category IC Interfaces
Product Number ZSSC4151CE1D
Product Name Sensor and Detector Interfaces
Device Type Storage Interface
Unlock Full Specs
to access all available technical data

Similar Products

Integrated Circuits (ICs) - Power Management (PMIC) - Display Drivers - 5447ADM - Acme Chip Technology Co., Limited
Texas Instruments
Integrated Circuits (ICs) - Power Management (PMIC) - Display Drivers
5447ADM
Specs
Device Type LCD Driver
View Details
Interface module - 289-177 - WAGO
WAGO
Interface module
289-177
Specs
Device Type Sensor Interface
Operating Temperature -40 to 85 C (-40 to 185 F)
View Details
Dual Interface Transceiver IC - 704-54ACT244/B2A - ERSAELECTRONICS PTE. LTD.
Rochester Electronics
Dual Interface Transceiver IC
54ACT244/B2A
Specs
Device Type Transceiver
Supply Voltage Other; 4.5V ~ 5.5V
Operating Temperature -55 C (-67 F)
View Details
2 suppliers
Telecom - SI3068-B-FSR - Quarktwin Technology Ltd.
Skyworks Solutions, Inc.
Telecom
SI3068-B-FSR
Specs
Features RoHS
Operating Temperature 0 to 70 C (32 to 158 F)
Package Type SOIC; 8-SOIC (0.154\", 3.90mm Width) Exposed Pad
View Details