Renesas Electronics Corporation Sensor and Detector Interfaces ZSSC3230BI1DES

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Sensor and Detector Interfaces - ZSSC3230BI1DES - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Sensor and Detector Interfaces
ZSSC3230BI1DES
Sensor and Detector Interfaces ZSSC3230BI1DES
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

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Shenzhen, China
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces
ZSSC3230BI1DES
Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces ZSSC3230BI1DES
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

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Technical Specifications

  Quarktwin Technology Ltd. Acme Chip Technology Co., Limited
Product Category IC Interfaces IC Interfaces
Product Number ZSSC3230BI1DES ZSSC3230BI1DES
Product Name Sensor and Detector Interfaces Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces
Device Type Storage Interface Sensor Interface
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