DICE (WAFER SAWN) - WAFFLE PACK
DICE (WAFER SAWN) - WAFFLE PACK
| Quarktwin Technology Ltd. | Acme Chip Technology Co., Limited | |
|---|---|---|
| Product Category | IC Interfaces | IC Interfaces |
| Product Number | ZSSC3230BI1DES | ZSSC3230BI1DES |
| Product Name | Sensor and Detector Interfaces | Integrated Circuits (ICs) - Interface - Sensor and Detector Interfaces |
| Device Type | Storage Interface | Sensor Interface |
