Renesas Electronics Corporation Interface - Sensor and Detector Interfaces ZSSC3218BI1C

Description
DICE (WAFER SAWN) - FRAME
Datasheet
Description
DICE (WAFER SAWN) - FRAME
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Interface - Sensor and Detector Interfaces - ZSSC3218BI1C - Lingto Electronic Limited
Shenzhen, China
Interface - Sensor and Detector Interfaces
ZSSC3218BI1C
Interface - Sensor and Detector Interfaces ZSSC3218BI1C
DICE (WAFER SAWN) - FRAME

DICE (WAFER SAWN) - FRAME

Supplier's Site Datasheet

Technical Specifications

  Lingto Electronic Limited
Product Category IC Interfaces
Product Number ZSSC3218BI1C
Product Name Interface - Sensor and Detector Interfaces
Device Type Sensor Interface
Unlock Full Specs
to access all available technical data

Similar Products

RF Front End (LNA + PA) - 2312-QPF4557SRTR-ND - DigiKey
Specs
Device Type Front End
Package Type 24-QFN Exposed Pad
Pins 24 #
View Details
Quad buffer; 3-state - 74ABT125D,623 - Nexperia B.V.
Specs
Technology TTL
Device Type Buffer
Features RoHS
View Details
2 suppliers
Type 38.21 - Timed interface modules - EMR & SSR - 382100480060 - Finder S.p.A. con unico socio
Specs
Device Type Sensor Interface
View Details
Latched Source Driver, 5.5V, Dip-18; No. Of Digits Allegro Microsystems - 31K6673 - Newark, An Avnet Company
Specs
Supply Voltage Other; 3V
Operating Temperature -20 C (-4 F)
Pins 18 #
View Details