Renesas Electronics Corporation Interface - Sensor and Detector Interfaces ZSSC3170EE1D

Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet
Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Interface - Sensor and Detector Interfaces - ZSSC3170EE1D - Lingto Electronic Limited
Shenzhen, China
Interface - Sensor and Detector Interfaces
ZSSC3170EE1D
Interface - Sensor and Detector Interfaces ZSSC3170EE1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site Datasheet
Sensor and Detector Interfaces - ZSSC3170EE1D - ODG (Origin Data Global)
Shenzhen, China
Sensor and Detector Interfaces
ZSSC3170EE1D
Sensor and Detector Interfaces ZSSC3170EE1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site Datasheet

Technical Specifications

  Lingto Electronic Limited ODG (Origin Data Global)
Product Category IC Interfaces IC Interfaces
Product Number ZSSC3170EE1D ZSSC3170EE1D
Product Name Interface - Sensor and Detector Interfaces Sensor and Detector Interfaces
Device Type Sensor Interface
Unlock Full Specs
to access all available technical data

Similar Products

RF Front End (LNA + PA) - 2312-QPF5012-ND - DigiKey
Specs
Device Type Front End
View Details
Power Switch ICs - 276953 - RS Components, Ltd.
RS Components, Ltd.
Specs
Features RoHS
Operating Temperature -40 to 85 C (-40 to 185 F)
Package Type DFN1216-8
View Details
Type 38.21 - Timed interface modules - EMR & SSR - 382102400060 - Finder S.p.A. con unico socio
Specs
Device Type Sensor Interface
View Details