Renesas Electronics Corporation Sensor and Detector Interfaces ZSSC3170EE1D

Description
DICE (WAFER SAWN) - WAFFLE PACK
  • Sensor and Detector Interfaces - ZSSC3170EE1D - ODG (Origin Data Global)
    ODG (Origin Data Global)
  • Interface - Sensor and Detector Interfaces - ZSSC3170EE1D - Lingto Electronic Limited
    Lingto Electronic Limited
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Description
DICE (WAFER SAWN) - WAFFLE PACK
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Suppliers

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Product
Description
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Sensor and Detector Interfaces - ZSSC3170EE1D - ODG (Origin Data Global)
ODG (Origin Data Global)
Shenzhen, China
Sensor and Detector Interfaces
ZSSC3170EE1D
Sensor and Detector Interfaces ZSSC3170EE1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site Datasheet
Interface - Sensor and Detector Interfaces - ZSSC3170EE1D - Lingto Electronic Limited
Lingto Electronic Limited
Shenzhen, China
Interface - Sensor and Detector Interfaces
ZSSC3170EE1D
Interface - Sensor and Detector Interfaces ZSSC3170EE1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site Datasheet

Technical Specifications

  ODG (Origin Data Global) Lingto Electronic Limited
Product Category IC Interfaces IC Interfaces
Product Number ZSSC3170EE1D ZSSC3170EE1D
Product Name Sensor and Detector Interfaces Interface - Sensor and Detector Interfaces
Device Type Sensor Interface
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