Renesas Electronics Corporation Sensor and Detector Interfaces ZSSC3170EE1D

Description

DICE (WAFER SAWN) - WAFFLE PACK

ODG (Origin Data Global)
Lingto Electronic Limited

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Datasheet

Description

DICE (WAFER SAWN) - WAFFLE PACK

Request a Quote

Email Supplier

Datasheet

Suppliers

Company

Product

Description

Supplier Links

ODG (Origin Data Global)

Shenzhen, China

Sensor and Detector Interfaces
ZSSC3170EE1D

Sensor and Detector Interfaces ZSSC3170EE1D

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site

Datasheet

Lingto Electronic Limited

Shenzhen, China

Interface - Sensor and Detector Interfaces
ZSSC3170EE1D

Interface - Sensor and Detector Interfaces ZSSC3170EE1D

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site

Datasheet

Technical Specifications

	ODG (Origin Data Global)	Lingto Electronic Limited
Product Category	IC Interfaces	IC Interfaces
Product Number	ZSSC3170EE1D	ZSSC3170EE1D
Product Name	Sensor and Detector Interfaces	Interface - Sensor and Detector Interfaces
Device Type		Sensor Interface

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