Renesas Electronics Corporation Interface - Sensor and Detector Interfaces ZSSC3136BE1C

Description
DICE (WAFER SAWN) - FRAME
Datasheet
Description
DICE (WAFER SAWN) - FRAME
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Interface - Sensor and Detector Interfaces - ZSSC3136BE1C - Lingto Electronic Limited
Shenzhen, China
Interface - Sensor and Detector Interfaces
ZSSC3136BE1C
Interface - Sensor and Detector Interfaces ZSSC3136BE1C
DICE (WAFER SAWN) - FRAME

DICE (WAFER SAWN) - FRAME

Supplier's Site Datasheet

Technical Specifications

  Lingto Electronic Limited
Product Category IC Interfaces
Product Number ZSSC3136BE1C
Product Name Interface - Sensor and Detector Interfaces
Device Type Sensor Interface
Unlock Full Specs
to access all available technical data

Similar Products

Encoders, Decoders, Converters - 54185AJ/B - Quarktwin Technology Ltd.
Specs
Device Type Sample Rate Converter
Features RoHS
View Details
Interface module - 289-179 - WAGO
Specs
Device Type Sensor Interface
Operating Temperature -40 to 85 C (-40 to 185 F)
View Details
Telecom - PEB 3324 E V1.4-G - Quarktwin Technology Ltd.
Infineon Technologies AG
Specs
Technology ADPCM
Features RoHS
Operating Temperature -40 to 85 C (-40 to 185 F)
View Details
2 suppliers