Renesas Electronics Corporation Interface - Sensor and Detector Interfaces ZSSC3135BE1D

Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet
Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Interface - Sensor and Detector Interfaces - ZSSC3135BE1D - Lingto Electronic Limited
Shenzhen, China
Interface - Sensor and Detector Interfaces
ZSSC3135BE1D
Interface - Sensor and Detector Interfaces ZSSC3135BE1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site Datasheet

Technical Specifications

  Lingto Electronic Limited
Product Category IC Interfaces
Product Number ZSSC3135BE1D
Product Name Interface - Sensor and Detector Interfaces
Device Type Sensor Interface
Unlock Full Specs
to access all available technical data

Similar Products

Buffers - 1222911 - RS Components, Ltd.
RS Components, Ltd.
Specs
Device Type Buffer; Buffer
Features RoHS
Package Type Sot-25
View Details
Interface module - 289-612 - WAGO
Specs
Device Type Sensor Interface
Operating Temperature -20 to 55 C (-4 to 131 F)
View Details
SN54AS756 Octal Buffers & Line Drivers With Open-Collector Outputs - 5962-9056301RA - Texas Instruments
Specs
Technology AS
Device Type Line / Bus Driver; Buffer
Supply Voltage Other; 5.5
View Details
Telecom - SI32176-B-GMR - Quarktwin Technology Ltd.
Skyworks Solutions, Inc.
Specs
Technology SPI; GCI, PCM, SPI
Features RoHS
Supply Voltage Other; 3.3V
View Details