Renesas Electronics Corporation Sensor and Detector Interfaces ZSSC3131BE1D

Description

DICE (WAFER SAWN) - WAFFLE PACK

ODG (Origin Data Global)
Lingto Electronic Limited

Request a Quote

Email Supplier

Datasheet

Description

DICE (WAFER SAWN) - WAFFLE PACK

Request a Quote

Email Supplier

Datasheet

Suppliers

Company

Product

Description

Supplier Links

ODG (Origin Data Global)

Shenzhen, China

Sensor and Detector Interfaces
ZSSC3131BE1D

Sensor and Detector Interfaces ZSSC3131BE1D

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site

Datasheet

Lingto Electronic Limited

Shenzhen, China

Interface - Sensor and Detector Interfaces
ZSSC3131BE1D

Interface - Sensor and Detector Interfaces ZSSC3131BE1D

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site

Datasheet

Technical Specifications

	ODG (Origin Data Global)	Lingto Electronic Limited
Product Category	IC Interfaces	IC Interfaces
Product Number	ZSSC3131BE1D	ZSSC3131BE1D
Product Name	Sensor and Detector Interfaces	Interface - Sensor and Detector Interfaces
Device Type		Sensor Interface

Unlock Full Specs

to access all available technical data

Similar Products

Infineon Technologies AG

Interface - Interface - Telecom - PEB 4264 T V1.2

PEB 4264 T V1.2

Specs

Device Type Sensor Interface

Supply Voltage Other; 3.3 V ~ 5 V

Package Type SOIC

View Details

3 suppliers

Nexperia B.V.

Unbuffered inverter

74AHC1GU04GV-Q100H

Specs

Device Type Buffer

Package Type SOT753

View Details

2 suppliers

Rochester Electronics

Interface - Sensor and Detector Interfaces

ADM1022ARQ-REEL

Specs

Device Type Sensor Interface

Operating Temperature 0 to 85 C (32 to 185 F)

View Details

Finder S.p.A. con unico socio

Type 38.21 - Timed interface modules - EMR & SSR

382102409024

Specs

Device Type Sensor Interface

View Details