DICE (WAFER SAWN) - WAFFLE PACK
DICE (WAFER SAWN) - WAFFLE PACK
| ODG (Origin Data Global) | Lingto Electronic Limited | |
|---|---|---|
| Product Category | IC Interfaces | IC Interfaces |
| Product Number | ZSSC3131BA1D | ZSSC3131BA1D |
| Product Name | Sensor and Detector Interfaces | Interface - Sensor and Detector Interfaces |
| Device Type | Sensor Interface |
