Renesas Electronics Corporation Interface - Sensor and Detector Interfaces ZSSC3036CI1D ES

Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet
Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Interface - Sensor and Detector Interfaces - ZSSC3036CI1D ES - Lingto Electronic Limited
Shenzhen, China
Interface - Sensor and Detector Interfaces
ZSSC3036CI1D ES
Interface - Sensor and Detector Interfaces ZSSC3036CI1D ES
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site Datasheet
Sensor and Detector Interfaces - ZSSC3036CI1D ES - ODG (Origin Data Global)
Shenzhen, China
Sensor and Detector Interfaces
ZSSC3036CI1D ES
Sensor and Detector Interfaces ZSSC3036CI1D ES
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site Datasheet

Technical Specifications

  Lingto Electronic Limited ODG (Origin Data Global)
Product Category IC Interfaces IC Interfaces
Product Number ZSSC3036CI1D ES ZSSC3036CI1D ES
Product Name Interface - Sensor and Detector Interfaces Sensor and Detector Interfaces
Device Type Sensor Interface
Unlock Full Specs
to access all available technical data

Similar Products

Interface - Specialized - AD9880KSTZ-100 - Lingto Electronic Limited
Specs
Technology Analog, HDMI
Device Type Sensor Interface
Package Type QFP; 100-LQFP
View Details
Interface module - 289-615 - WAGO
Specs
Device Type Sensor Interface
Operating Temperature -20 to 55 C (-4 to 131 F)
View Details
RF Front End (LNA + PA) - 2312-QPB9351TR13TR-ND - DigiKey
Specs
Device Type Front End
Package Type 32-VFQFN Exposed Pad
Pins 32 #
View Details
Power Switch ICs - 1702282 - RS Components, Ltd.
Infineon Technologies AG
Specs
Features RoHS
Supply Voltage Other; 5.5 v
Package Type SOIC; Soic
View Details