Renesas Electronics Corporation Sensor and Detector Interfaces ZSC31010CED

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DICE (WAFER SAWN) - WAFFLE PACK
  • Sensor and Detector Interfaces - ZSC31010CED - ODG (Origin Data Global)
    ODG (Origin Data Global)
  • Interface - Sensor and Detector Interfaces - ZSC31010CED - Lingto Electronic Limited
    Lingto Electronic Limited
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Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet

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Sensor and Detector Interfaces - ZSC31010CED - ODG (Origin Data Global)
ODG (Origin Data Global)
Shenzhen, China
Sensor and Detector Interfaces
ZSC31010CED
Sensor and Detector Interfaces ZSC31010CED
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site Datasheet
Interface - Sensor and Detector Interfaces - ZSC31010CED - Lingto Electronic Limited
Lingto Electronic Limited
Shenzhen, China
Interface - Sensor and Detector Interfaces
ZSC31010CED
Interface - Sensor and Detector Interfaces ZSC31010CED
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site Datasheet

Technical Specifications

  ODG (Origin Data Global) Lingto Electronic Limited
Product Category IC Interfaces IC Interfaces
Product Number ZSC31010CED ZSC31010CED
Product Name Sensor and Detector Interfaces Interface - Sensor and Detector Interfaces
Device Type Sensor Interface
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