Renesas Electronics Corporation Integrated Circuits (ICs) - Interface - Telecom HC55261P

Description
ITU CO/PABX SLIC WITH LOW POWER
Description
ITU CO/PABX SLIC WITH LOW POWER

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Interface - Telecom - HC55261P - Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Interface - Telecom
HC55261P
Integrated Circuits (ICs) - Interface - Telecom HC55261P
ITU CO/PABX SLIC WITH LOW POWER

ITU CO/PABX SLIC WITH LOW POWER

Supplier's Site

Technical Specifications

  Acme Chip Technology Co., Limited
Product Category IC Interfaces
Product Number HC55261P
Product Name Integrated Circuits (ICs) - Interface - Telecom
Device Type Sensor Interface
Unlock Full Specs
to access all available technical data

Similar Products

Type 38.21 - Timed interface modules - EMR & SSR - 382101258240 - Finder S.p.A. con unico socio
Specs
Device Type Sensor Interface
View Details
 - 26LS32DM/B - Rochester Electronics
Specs
Technology RS422
Package Type DIP; CDIP; CDIP16
View Details
2 suppliers
Interface module - 704-5004 - WAGO
Specs
Device Type Sensor Interface
Operating Temperature -25 to 50 C (-13 to 122 F)
View Details