Renesas Electronics Corporation Integrated Circuits (ICs) - Interface - Telecom HC5513BIMX6176C

Description
DLC/FLC SLIC WITH LOW POWER STAN
Description
DLC/FLC SLIC WITH LOW POWER STAN

Suppliers

Company
Product
Description
Supplier Links
Shenzhen, China
Integrated Circuits (ICs) - Interface - Telecom
HC5513BIMX6176C
Integrated Circuits (ICs) - Interface - Telecom HC5513BIMX6176C
DLC/FLC SLIC WITH LOW POWER STAN

DLC/FLC SLIC WITH LOW POWER STAN

Supplier's Site

Technical Specifications

  Acme Chip Technology Co., Limited
Product Category IC Interfaces
Product Number HC5513BIMX6176C
Product Name Integrated Circuits (ICs) - Interface - Telecom
Device Type Sensor Interface
Unlock Full Specs
to access all available technical data

Similar Products

RF Front End (LNA + PA) - 2312-QPF4001SRTR-ND - DigiKey
Specs
Device Type Front End
Package Type 24-SMD Module
Pins 24 #
View Details
Specs
Device Type Transceiver
Operating Temperature -45 C (-49 F)
Pins 16 #
View Details
2 suppliers
Interface module - 704-5303 - WAGO
Specs
Device Type Sensor Interface
Operating Temperature -25 to 40 C (-13 to 104 F)
View Details
Interface - Specialized - 32P4101A-CGF - Lingto Electronic Limited
Specs
Device Type Sensor Interface
View Details