Renesas Electronics Corporation Integrated Circuits (ICs) - Memory - Controllers 4DB0226KB0AVG

Description
FCCSP 7.50X3.00X1.20 MM, 0.50MM
  • Integrated Circuits (ICs) - Memory - Controllers - 4DB0226KB0AVG - Shenzhen Shengyu Electronics Technology Limited
    Shenzhen Shengyu Electronics Technology Limited
Description
FCCSP 7.50X3.00X1.20 MM, 0.50MM

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Memory - Controllers - 4DB0226KB0AVG - Shenzhen Shengyu Electronics Technology Limited
Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory - Controllers
4DB0226KB0AVG
Integrated Circuits (ICs) - Memory - Controllers 4DB0226KB0AVG
FCCSP 7.50X3.00X1.20 MM, 0.50MM

FCCSP 7.50X3.00X1.20 MM, 0.50MM

Supplier's Site

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited
Product Category IC Interfaces
Product Number 4DB0226KB0AVG
Product Name Integrated Circuits (ICs) - Memory - Controllers
Device Type CardBus Controller
Unlock Full Specs
to access all available technical data

Similar Products

Specialized - 34P3216A-CGT - Quarktwin Technology Ltd.
Texas Instruments
Specialized
34P3216A-CGT
Specs
Features RoHS
View Details
2 suppliers
Type 38.21 - Timed interface modules - EMR & SSR - 382100480060 - Finder S.p.A. con unico socio
Finder S.p.A. con unico socio
Type 38.21 - Timed interface modules - EMR & SSR
382100480060
Specs
Device Type Sensor Interface
View Details
RF Front End (LNA + PA) - 2312-QPB9348TR13TR-ND - DigiKey
Qorvo
RF Front End (LNA + PA)
QPB9348TR13
Specs
Device Type Front End
Package Type 40-VFQFN Exposed Pad
Pins 40 #
View Details
Telecom - SI3066-B-FSR - Quarktwin Technology Ltd.
Skyworks Solutions, Inc.
Telecom
SI3066-B-FSR
Specs
Features RoHS
Operating Temperature 0 to 70 C (32 to 158 F)
Package Type SOIC; 8-SOIC (0.154\", 3.90mm Width) Exposed Pad
View Details