QUALCOMM, Incorporated Bluetooth Chipset QCC3006

Description
Entry-level, flash programmable audio platform for Bluetooth speakers QCC3006 Specs Bluetooth Bluetooth Version Bluetooth 5.0 Bluetooth Technology Dual-mode Bluetooth Bluetooth Profiles HFP v1.7 A2DP v1.3 AVRCPv1.5 Audio Audio Technology Qualcomm® cVc™ audio technology Qualcomm TrueWireless™ Technology Digital Microphone Input 1 digital mic Channel Output Mono DSP DSP Technology Qualcomm® Kalimba™ DSP MCU MCU Clock Speed 80MHz Memory Flash Up to 64 MB external flash Interface Supported Interfaces USB 3.0 USB 2.0 I²S SPDIF Package Package Type QFN Pitch 0.4mm Package Size 8 x 8 x 0.9 mm
Description
Entry-level, flash programmable audio platform for Bluetooth speakers QCC3006 Specs Bluetooth Bluetooth Version Bluetooth 5.0 Bluetooth Technology Dual-mode Bluetooth Bluetooth Profiles HFP v1.7 A2DP v1.3 AVRCPv1.5 Audio Audio Technology Qualcomm® cVc™ audio technology Qualcomm TrueWireless™ Technology Digital Microphone Input 1 digital mic Channel Output Mono DSP DSP Technology Qualcomm® Kalimba™ DSP MCU MCU Clock Speed 80MHz Memory Flash Up to 64 MB external flash Interface Supported Interfaces USB 3.0 USB 2.0 I²S SPDIF Package Package Type QFN Pitch 0.4mm Package Size 8 x 8 x 0.9 mm

Suppliers

Company
Product
Description
Supplier Links
Bluetooth Chipset - QCC3006 - QUALCOMM, Incorporated
San Diego, CA, USA
Bluetooth Chipset
QCC3006
Bluetooth Chipset QCC3006
Entry-level, flash programmable audio platform for Bluetooth speakers QCC3006 Specs Bluetooth Bluetooth Version Bluetooth 5.0 Bluetooth Technology Dual-mode Bluetooth Bluetooth Profiles HFP v1.7 A2DP v1.3 AVRCPv1.5 Audio Audio Technology Qualcomm® cVc™ audio technology Qualcomm TrueWireless™ Technology Digital Microphone Input 1 digital mic Channel Output Mono DSP DSP Technology Qualcomm® Kalimba™ DSP MCU MCU Clock Speed 80MHz Memory Flash Up to 64 MB external flash Interface Supported Interfaces USB 3.0 USB 2.0 I²S SPDIF Package Package Type QFN Pitch 0.4mm Package Size 8 x 8 x 0.9 mm

Entry-level, flash programmable audio platform for Bluetooth speakers

QCC3006 Specs

Bluetooth

Bluetooth Version

  • Bluetooth 5.0

Bluetooth Technology

  • Dual-mode Bluetooth

Bluetooth Profiles

  • HFP v1.7
  • A2DP v1.3
  • AVRCPv1.5

Audio

Audio Technology

  • Qualcomm® cVc™ audio technology
  • Qualcomm TrueWireless™ Technology

Digital Microphone Input

  • 1 digital mic

Channel Output

  • Mono

DSP

DSP Technology

  • Qualcomm® Kalimba™ DSP

MCU

MCU Clock Speed

  • 80MHz

Memory

Flash

  • Up to 64 MB external flash

Interface

Supported Interfaces

  • USB 3.0
  • USB 2.0
  • I²S
  • SPDIF

Package

Package Type

  • QFN

Pitch

  • 0.4mm

Package Size

  • 8 x 8 x 0.9 mm
Supplier's Site

Technical Specifications

  QUALCOMM, Incorporated
Product Category Network and Communication Chips
Product Number QCC3006
Product Name Bluetooth Chipset
Technology Bluetooth
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