QUALCOMM, Incorporated Bluetooth Chipset QCC3002

Description
Entry-level, flash programmable audio platform for Bluetooth headsets QCC3002 Specs Bluetooth Bluetooth Version Bluetooth 5.0 Bluetooth Technology Dual-mode Bluetooth Bluetooth Profiles HFP v1.7 A2DP v1.3 AVRCPv1.5 Audio Audio Technology Qualcomm® aptX™ codec technology Qualcomm® cVc™ audio technology Qualcomm TrueWireless™ Technology Qualcomm® aptX™ playback support aptX Classic Channel Output Mono DSP DSP Technology Qualcomm® Kalimba™ DSP MCU MCU Clock Speed 80MHz Memory Flash Up to 64 MB external flash Interface Supported Interfaces USB 3.0 USB 2.0 I²S SPDIF Package Package Type WLCSP BGA Pitch 0.5mm Package Size 3.9 x 3.6 x 0.6mm 5.5 x 5.5 x 1 mm
Description
Entry-level, flash programmable audio platform for Bluetooth headsets QCC3002 Specs Bluetooth Bluetooth Version Bluetooth 5.0 Bluetooth Technology Dual-mode Bluetooth Bluetooth Profiles HFP v1.7 A2DP v1.3 AVRCPv1.5 Audio Audio Technology Qualcomm® aptX™ codec technology Qualcomm® cVc™ audio technology Qualcomm TrueWireless™ Technology Qualcomm® aptX™ playback support aptX Classic Channel Output Mono DSP DSP Technology Qualcomm® Kalimba™ DSP MCU MCU Clock Speed 80MHz Memory Flash Up to 64 MB external flash Interface Supported Interfaces USB 3.0 USB 2.0 I²S SPDIF Package Package Type WLCSP BGA Pitch 0.5mm Package Size 3.9 x 3.6 x 0.6mm 5.5 x 5.5 x 1 mm

Suppliers

Company
Product
Description
Supplier Links
Bluetooth Chipset - QCC3002 - QUALCOMM, Incorporated
San Diego, CA, USA
Bluetooth Chipset
QCC3002
Bluetooth Chipset QCC3002
Entry-level, flash programmable audio platform for Bluetooth headsets QCC3002 Specs Bluetooth Bluetooth Version Bluetooth 5.0 Bluetooth Technology Dual-mode Bluetooth Bluetooth Profiles HFP v1.7 A2DP v1.3 AVRCPv1.5 Audio Audio Technology Qualcomm® aptX™ codec technology Qualcomm® cVc™ audio technology Qualcomm TrueWireless™ Technology Qualcomm® aptX™ playback support aptX Classic Channel Output Mono DSP DSP Technology Qualcomm® Kalimba™ DSP MCU MCU Clock Speed 80MHz Memory Flash Up to 64 MB external flash Interface Supported Interfaces USB 3.0 USB 2.0 I²S SPDIF Package Package Type WLCSP BGA Pitch 0.5mm Package Size 3.9 x 3.6 x 0.6mm 5.5 x 5.5 x 1 mm

Entry-level, flash programmable audio platform for Bluetooth headsets

QCC3002 Specs

Bluetooth

Bluetooth Version

  • Bluetooth 5.0

Bluetooth Technology

  • Dual-mode Bluetooth

Bluetooth Profiles

  • HFP v1.7
  • A2DP v1.3
  • AVRCPv1.5

Audio

Audio Technology

  • Qualcomm® aptX™ codec technology
  • Qualcomm® cVc™ audio technology
  • Qualcomm TrueWireless™ Technology

Qualcomm® aptX™ playback support

  • aptX Classic

Channel Output

  • Mono

DSP

DSP Technology

  • Qualcomm® Kalimba™ DSP

MCU

MCU Clock Speed

  • 80MHz

Memory

Flash

  • Up to 64 MB external flash

Interface

Supported Interfaces

  • USB 3.0
  • USB 2.0
  • I²S
  • SPDIF

Package

Package Type

  • WLCSP
  • BGA

Pitch

  • 0.5mm

Package Size

  • 3.9 x 3.6 x 0.6mm
  • 5.5 x 5.5 x 1 mm
Supplier's Site

Technical Specifications

  QUALCOMM, Incorporated
Product Category Network and Communication Chips
Product Number QCC3002
Product Name Bluetooth Chipset
Technology Bluetooth
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