QUALCOMM, Incorporated Bluetooth Chipset QCC3001

Entry-level, flash programmable audio platform for Bluetooth headsets QCC3001 Specs Bluetooth Bluetooth Version Bluetooth 5.0 Bluetooth Technology Dual-mode Bluetooth Bluetooth Profiles HFP v1.7 A2DP v1.3 AVRCPv1.5 Audio Audio Technology Qualcomm® cVc™ audio technology Qualcomm TrueWireless™ Technology Channel Output Mono DSP DSP Technology Qualcomm® Kalimba™ DSP MCU MCU Clock Speed 80MHz Memory Flash Up to 64 MB external flash Interface Supported Interfaces USB 3.0 USB 2.0 I²S SPDIF Package Package Type WLCSP BGA Pitch 0.5mm Package Size 3.9 x 3.6 x 0.6mm 5.5 x 5.5 x 1 mm