Plastronics Socket Company, Inc. Open Top H-Pin® IC Socket (RB) Open Top H-Pin® Socket (RB)

Description
Flexible socket designs - reduced cost and lead-time Integrated socket solutions - reduced risk In-house tool and mold - rapid response and turnaround Extensive catalog - easy purchase Our reputation was built by solving the toughest challenges that burn-in socket customers face - the ability to get the right socket, for the lowest price, in the shortest amount of time. We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages. Click on an LGA socket product in the table below to learn more.
Datasheet
Description
Flexible socket designs - reduced cost and lead-time Integrated socket solutions - reduced risk In-house tool and mold - rapid response and turnaround Extensive catalog - easy purchase Our reputation was built by solving the toughest challenges that burn-in socket customers face - the ability to get the right socket, for the lowest price, in the shortest amount of time. We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages. Click on an LGA socket product in the table below to learn more.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Open Top H-Pin® IC Socket (RB) - Open Top H-Pin® Socket (RB) - Plastronics Socket Company, Inc.
Irving, TX, United States
Open Top H-Pin® IC Socket (RB)
Open Top H-Pin® Socket (RB)
Open Top H-Pin® IC Socket (RB) Open Top H-Pin® Socket (RB)
Flexible socket designs - reduced cost and lead-time Integrated socket solutions - reduced risk In-house tool and mold - rapid response and turnaround Extensive catalog - easy purchase Our reputation was built by solving the toughest challenges that burn-in socket customers face - the ability to get the right socket, for the lowest price, in the shortest amount of time. We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages. Click on an LGA socket product in the table below to learn more.
  • Flexible socket designs - reduced cost and
    lead-time
  • Integrated socket solutions - reduced risk
  • In-house tool and mold - rapid response and turnaround
  • Extensive catalog - easy purchase

Our reputation was built by solving the toughest challenges that burn-in socket customers face - the ability to get the right socket, for the lowest price, in the shortest amount of time.

We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market.

Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.

Click on an LGA socket product in the table below to learn more.

Supplier's Site Datasheet

Technical Specifications

  Plastronics Socket Company, Inc.
Product Category IC Interconnect Components
Product Number Open Top H-Pin® Socket (RB)
Product Name Open Top H-Pin® IC Socket (RB)
Product Type IC Socket
Socket Type LGA
Features Open-Top
Current Rating 1 amps
Contact Resistance 30 milliohms
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