Smiths Interconnect Thermal Management Lid Capabilities: IC Test Solutions

Description
Smiths Interconnect offers high value Thermal Management Lid capabilities including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts. Our solutions are developed to be compatible with existing test hardware footprints for simple integration, reducing test set-up time and overall cost. Features & Benefits Features Using state of the art simulation capabilities, the design is optimized to achieve efficient heat dissipation Compact, table-top chiller unit Compatible with conventional socket and lid mounting design footprints Utilizes air or liquid cooling mediums Customizable hose connector Optional air purge features Benefits Stabilizes junction temperature within desired range allowing IC package testing at higher thermal power point for a longer duration ensuring a more accurate test Small size takes less space in test lab Increased test efficiency and accuracy provides greater throughput Compatible with existing test hardware, coolant mediums and air inlets, reducing overall cost of test
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Thermal Management Lid Capabilities: IC Test Solutions -  - Smiths Interconnect
London, United Kingdom
Thermal Management Lid Capabilities: IC Test Solutions
Thermal Management Lid Capabilities: IC Test Solutions
Smiths Interconnect offers high value Thermal Management Lid capabilities including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts. Our solutions are developed to be compatible with existing test hardware footprints for simple integration, reducing test set-up time and overall cost. Features & Benefits Features Using state of the art simulation capabilities, the design is optimized to achieve efficient heat dissipation Compact, table-top chiller unit Compatible with conventional socket and lid mounting design footprints Utilizes air or liquid cooling mediums Customizable hose connector Optional air purge features Benefits Stabilizes junction temperature within desired range allowing IC package testing at higher thermal power point for a longer duration ensuring a more accurate test Small size takes less space in test lab Increased test efficiency and accuracy provides greater throughput Compatible with existing test hardware, coolant mediums and air inlets, reducing overall cost of test

Smiths Interconnect offers high value Thermal Management Lid capabilities including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts. Our solutions are developed to be compatible with existing test hardware footprints for simple integration, reducing test set-up time and overall cost.

Features & Benefits

Features

  • Using state of the art simulation capabilities, the design is optimized to achieve efficient heat dissipation
  • Compact, table-top chiller unit
  • Compatible with conventional socket and lid mounting design footprints
  • Utilizes air or liquid cooling mediums
  • Customizable hose connector
  • Optional air purge features

Benefits

  • Stabilizes junction temperature within desired range allowing IC package testing at higher thermal power point for a longer duration ensuring a more accurate test
  • Small size takes less space in test lab
  • Increased test efficiency and accuracy provides greater throughput
  • Compatible with existing test hardware, coolant mediums and air inlets, reducing overall cost of test
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Technical Specifications

  Smiths Interconnect
Product Category IC Interconnect Components
Product Name Thermal Management Lid Capabilities: IC Test Solutions
Product Type IC Socket
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