As in all Plasma Etch systems a capacitive parallel plate design is used for the most effective plasma generation. Competitive units with glass/quartz barrel chambers cannot penetrate the vacuum containment vessel and therefore are restricted to inductive coupling using an RF coil wrapped around the exterior of the chamber.This is an inefficient method resulting in loss of power input and considerably lower etch/clean removal rates.The PE-50 is comprised of components made in the USA and is built in and supported from our Carson City, NV headquarters with the best customer service available in the industry.
| Plasma Etch, Inc. | |
|---|---|
| Product Category | MEMS Processing Equipment |
| Product Number | PE-50 XL |
| Product Name | Benchtop Plasma Cleaner |
| Type | Laboratory or Benchtop |
| Process | Plasma Etching and Cleaning |
| Applications | MEMS; Photovoltaic or solar cell; Research / Surface Analysis; Semiconductors; Medical; Printed Circuit Boards |
| Materials Processed | Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals |
