The generous aluminum chambers accommodates a properly sized active processing surface with our standard configurations having dual bays as few as 6 or as many as 24 plasma processing levels, each 24” by 18.”
Our oxygen service vacuum pump and booster is equipped with a two point purge system to minimize any corrosive end products forming in the pump thereby extending the service life while lowering maintenance costs
| Plasma Etch, Inc. | |
|---|---|
| Product Category | Thin Film Equipment |
| Product Number | MK-III |
| Product Name | High Production Plasma System |
| Type | Free Standing System |
| Process | Plasma Etching and Cleaning |
| Applications | Research / Surface Analysis; Printed Circuit Boards |
| Materials Processed | Tungsten; Metal; Gallium Arsenide or Compound Semiconductors; Precious Metals |
