- Trained on our vast library of engineering resources.

Plansee SE Molybdenum-Tungsten Sputtering Target

Description
Our molybdenum tungsten alloys (MoW) offer enhanced stability against ITO, aluminum or copper etching solutions. By adding tungsten to pure molybdenum we can selectively slow down the speed of etching. We can adapt the tungsten concentration in the target precisely to meet your requirements and respond to the needs of your application. Thanks to our powder metallurgical production process, we can guarantee that you benefit from a uniform tungsten distribution. Flawless quality from a single supplier. We are the only manufacturer of sputtering targets to perform every stage of the production process in-house. From the raw material through to the finished product: including the development of new materials and the optimization of our coating methods and coatings. Sintering is the cornerstone of our powder metallurgical production process. This is the method we use to manufacture compact metallic components from porous powder blanks. With the world's largest hot rolling mill for refractory metals, we produce planar targets of maximum density. We use special forming processes to manufacture our rotary targets. You want the perfect coating? We create it. In the PVD process, everything must fit together perfectly. Only if all the process parameters are fully harmonized it is possible to create the coating that precisely meets your requirements. In our PVD application laboratory, we perform sputtering in near-real life conditions. Here, our team of developers creates coatings and conducts in-depth analyses based on your specifications. Thanks to this collaboration with you and a wide range of development institutes, we can minimize the time to market required for the development of new coating materials. The best proof of our expertise is us! We coat many of our products such as semiconductor base plates and x-ray targets in-house using the PVD, CVD, APS and VPS coating processes. Raw material: sure and certain. Ever since 1921, our customers have been able to rely on Plansee as an independent private company. Like us, they place great importance on reliability and continuity – especially when it comes to raw materials procurement. With Global Tungsten & Powders (GTP) and a holding in Molibdenos y Metales (Molymet), the Plansee-Group covers all the stages involved in the processing of tungsten and molybdenum – from powder manufacture through the subsequent powder metallurgy processes and on to the production of semifinished products and customer-specific components.

Suppliers

Company
Product
Description
Supplier Links
Molybdenum-Tungsten Sputtering Target -  - Plansee SE
Reutte, Austria
Molybdenum-Tungsten Sputtering Target
Molybdenum-Tungsten Sputtering Target
Our molybdenum tungsten alloys (MoW) offer enhanced stability against ITO, aluminum or copper etching solutions. By adding tungsten to pure molybdenum we can selectively slow down the speed of etching. We can adapt the tungsten concentration in the target precisely to meet your requirements and respond to the needs of your application. Thanks to our powder metallurgical production process, we can guarantee that you benefit from a uniform tungsten distribution. Flawless quality from a single supplier. We are the only manufacturer of sputtering targets to perform every stage of the production process in-house. From the raw material through to the finished product: including the development of new materials and the optimization of our coating methods and coatings. Sintering is the cornerstone of our powder metallurgical production process. This is the method we use to manufacture compact metallic components from porous powder blanks. With the world's largest hot rolling mill for refractory metals, we produce planar targets of maximum density. We use special forming processes to manufacture our rotary targets. You want the perfect coating? We create it. In the PVD process, everything must fit together perfectly. Only if all the process parameters are fully harmonized it is possible to create the coating that precisely meets your requirements. In our PVD application laboratory, we perform sputtering in near-real life conditions. Here, our team of developers creates coatings and conducts in-depth analyses based on your specifications. Thanks to this collaboration with you and a wide range of development institutes, we can minimize the time to market required for the development of new coating materials. The best proof of our expertise is us! We coat many of our products such as semiconductor base plates and x-ray targets in-house using the PVD, CVD, APS and VPS coating processes. Raw material: sure and certain. Ever since 1921, our customers have been able to rely on Plansee as an independent private company. Like us, they place great importance on reliability and continuity – especially when it comes to raw materials procurement. With Global Tungsten & Powders (GTP) and a holding in Molibdenos y Metales (Molymet), the Plansee-Group covers all the stages involved in the processing of tungsten and molybdenum – from powder manufacture through the subsequent powder metallurgy processes and on to the production of semifinished products and customer-specific components.

Our molybdenum tungsten alloys (MoW) offer enhanced stability against ITO, aluminum or copper etching solutions. By adding tungsten to pure molybdenum we can selectively slow down the speed of etching. We can adapt the tungsten concentration in the target precisely to meet your requirements and respond to the needs of your application. Thanks to our powder metallurgical production process, we can guarantee that you benefit from a uniform tungsten distribution.

Flawless quality from a single supplier.

We are the only manufacturer of sputtering targets to perform every stage of the production process in-house. From the raw material through to the finished product: including the development of new materials and the optimization of our coating methods and coatings.

Sintering is the cornerstone of our powder metallurgical production process. This is the method we use to manufacture compact metallic components from porous powder blanks. With the world's largest hot rolling mill for refractory metals, we produce planar targets of maximum density. We use special forming processes to manufacture our rotary targets.

You want the perfect coating? We create it.

In the PVD process, everything must fit together perfectly. Only if all the process parameters are fully harmonized it is possible to create the coating that precisely meets your requirements. In our PVD application laboratory, we perform sputtering in near-real life conditions. Here, our team of developers creates coatings and conducts in-depth analyses based on your specifications. Thanks to this collaboration with you and a wide range of development institutes, we can minimize the time to market required for the development of new coating materials.

The best proof of our expertise is us! We coat many of our products such as semiconductor base plates and x-ray targets in-house using the PVD, CVD, APS and VPS coating processes.

Raw material: sure and certain.

Ever since 1921, our customers have been able to rely on Plansee as an independent private company. Like us, they place great importance on reliability and continuity – especially when it comes to raw materials procurement. With Global Tungsten & Powders (GTP) and a holding in Molibdenos y Metales (Molymet), the Plansee-Group covers all the stages involved in the processing of tungsten and molybdenum – from powder manufacture through the subsequent powder metallurgy processes and on to the production of semifinished products and customer-specific components.

Supplier's Site

Technical Specifications

  Plansee SE
Product Category Thin Film Materials
Product Name Molybdenum-Tungsten Sputtering Target
Type Sputtering Target
Unlock Full Specs
to access all available technical data

Similar Products

Specialty Ceramics - Electronic Materials - Linde Advanced Material Technologies
Linde Advanced Material Technologies
Specs
Type Sputtering Target; Powder, Granule, Lumps, Flakes, etc.
Applications Semiconductors
View Details
DC Magnetron SiC Sputtering Target SiC Thin Films - Hexaloy® SG - Saint-Gobain Performance Ceramics & Refractories
Saint-Gobain Performance Ceramics & Refractories
Specs
Type Sputtering Target
Material Hexoloy
Applications Decorative / Shielding; Optical Coatings; Magnetic storage; Vapor Barrier
View Details
Sputtering Target W - 3N5 - Sputtering Target W - 3N5 - Umicore Metal Deposition Solutions
Specs
Type Sputtering Target
Material Barrier; Metal; Tungsten;

W

Purity 99.95 %
View Details
2 suppliers
Gallium Metal -  - Indium Corporation
Indium Corporation
Specs
Type EvapSource; Sputtering Target; Planar; Rotary or Cylindrical; Powder, Granule, Lumps, Flakes, etc.
Material Gallium
Applications Photovoltaic or solar cell; Semiconductors
View Details