Panasonic Thermal Interface Material, 66X126Mm; Thermal Conductivity Panasonic EYGS0713ZLAG

Description
THERMAL INTERFACE MATERIAL, 66X126MM; Thermal Conductivity:400W/m. K; Conductive Material:Graphite Sheet; Thickness:200µm; Thermal Impedance:-; Dielectric Strength:-; External Length:126mm; External Width:66mm; Product Range:EYGS RoHS Compliant: Yes
Datasheet
Description
THERMAL INTERFACE MATERIAL, 66X126MM; Thermal Conductivity:400W/m. K; Conductive Material:Graphite Sheet; Thickness:200µm; Thermal Impedance:-; Dielectric Strength:-; External Length:126mm; External Width:66mm; Product Range:EYGS RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Material, 66X126Mm; Thermal Conductivity Panasonic - 13AC3481 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Material, 66X126Mm; Thermal Conductivity Panasonic
13AC3481
Thermal Interface Material, 66X126Mm; Thermal Conductivity Panasonic 13AC3481
THERMAL INTERFACE MATERIAL, 66X126MM; Thermal Conductivity:400W/m. K; Conductive Material:Graphite Sheet; Thickness:200µm; Thermal Impedance:-; Dielectric Strength:-; External Length:126mm; External Width:66mm; Product Range:EYGS RoHS Compliant: Yes

THERMAL INTERFACE MATERIAL, 66X126MM; Thermal Conductivity:400W/m.K; Conductive Material:Graphite Sheet; Thickness:200µm; Thermal Impedance:-; Dielectric Strength:-; External Length:126mm; External Width:66mm; Product Range:EYGS RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 13AC3481
Product Name Thermal Interface Material, 66X126Mm; Thermal Conductivity Panasonic
Thermal Conductivity 400 W/m-K (231 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

High Performance Thermal Gap Filler - SARCON® GR130A - Fujipoly® America Corp.
Specs
Form / Shape Pad; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Gap Fill 0.0118 to 0.0787 inch (0.3000 to 2 mm)
View Details
Underfill Materials for Printed Circuit Boards (PCBs) - ALPHA ® HiTech ® CU31-3300 - MacDermid Alpha Electronics Solutions
Specs
Industry Electronics; Semiconductors, IC's
Elongation 10.1 %
Dielectric Strength 635 kV/in (250 kV/cm)
View Details
Thin and tear-resistant silicone insulator pad - SC800-PI-2-K6 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details