The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders.
Applications
Large complex hybrids
HB/HP LED arrays
Optoelectronic packaging
Chip-on-board (COB)
System in packages (SiPs)
Specialty lead frames
Automotive assemblies
Flex circuits
Multi-chip modules (MCMs)
Fine pitch devices
LEDs with running stitch
The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology and operator ergonomics, making it the next generation of fine wire bonders.
Applications
- Large complex hybrids
- HB/HP LED arrays
- Optoelectronic packaging
- Chip-on-board (COB)
- System in packages (SiPs)
- Specialty lead frames
- Automotive assemblies
- Flex circuits
- Multi-chip modules (MCMs)
- Fine pitch devices
- LEDs with running stitch
