onsemi Integrated Circuits (ICs) - Interface - Drivers, Receivers, Transceivers FIN1019M

Description
IC TRANSCEIVER FULL 1/1 14SOIC
Description
IC TRANSCEIVER FULL 1/1 14SOIC
Datasheet
Datasheet Summary
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The FIN1019M is a 3.3V LVDS high-speed differential driver and receiver designed for high-speed interconnects using Low Voltage Differential Signaling (LVDS) technology. It features a typical differential output swing of 350mV and a differential input threshold of 100mV, making it suitable for translating LVTTL signals to LVDS levels and vice versa. The device supports data rates greater than 400 Mbps, with a maximum differential pulse skew of 0.5ns and a maximum propagation delay of 2.5ns. The FIN1019M operates with low power dissipation and includes power-off protection, ensuring reliability in various conditions. It also incorporates fail-safe protection for open-circuit, shorted, and terminated conditions. The device is compliant with the TIA/EIA-644 LVDS standard and features a flow-through pinout that simplifies PCB layout. It is available in two package types: a 14-lead Small Outline Integrated Circuit (SOIC) and a 14-lead Thin Shrink Small Outline Package (TSSOP), both of which are designed to save space in applications.

Datasheet Summary
Powered by GS/AI

The FIN1019M is a 3.3V LVDS high-speed differential driver and receiver designed for high-speed interconnects using Low Voltage Differential Signaling (LVDS) technology. It features a typical differential output swing of 350mV and a differential input threshold of 100mV, making it suitable for translating LVTTL signals to LVDS levels and vice versa. The device supports data rates greater than 400 Mbps, with a maximum differential pulse skew of 0.5ns and a maximum propagation delay of 2.5ns. The FIN1019M operates with low power dissipation and includes power-off protection, ensuring reliability in various conditions. It also incorporates fail-safe protection for open-circuit, shorted, and terminated conditions. The device is compliant with the TIA/EIA-644 LVDS standard and features a flow-through pinout that simplifies PCB layout. It is available in two package types: a 14-lead Small Outline Integrated Circuit (SOIC) and a 14-lead Thin Shrink Small Outline Package (TSSOP), both of which are designed to save space in applications.

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Interface - Drivers, Receivers, Transceivers - FIN1019M - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Interface - Drivers, Receivers, Transceivers
FIN1019M
Integrated Circuits (ICs) - Interface - Drivers, Receivers, Transceivers FIN1019M
IC TRANSCEIVER FULL 1/1 14SOIC

IC TRANSCEIVER FULL 1/1 14SOIC

Supplier's Site
Drivers, Receivers, Transceivers - FIN1019M - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Drivers, Receivers, Transceivers
FIN1019M
Drivers, Receivers, Transceivers FIN1019M
1/1 Transceiver Full LVDS 14-SOIC

1/1 Transceiver Full LVDS 14-SOIC

Buy Now Datasheet
Drivers, Receivers, Transceivers - FIN1019M - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Drivers, Receivers, Transceivers
FIN1019M
Drivers, Receivers, Transceivers FIN1019M
1/1 Transceiver Full LVDS 14-SOIC

1/1 Transceiver Full LVDS 14-SOIC

Buy Now Datasheet

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd.
Product Category RF Transceivers RF Transceivers
Product Number FIN1019M FIN1019M
Product Name Integrated Circuits (ICs) - Interface - Drivers, Receivers, Transceivers Drivers, Receivers, Transceivers
Package Type Surface Mount; 14-SOIC (0.154\", 3.90mm Width)
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