onsemi Drivers, Receivers, Transceivers FIN1019M

Description
1/1 Transceiver Full LVDS 14-SOIC
Description
1/1 Transceiver Full LVDS 14-SOIC
Datasheet
Datasheet Summary
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The FIN1019M is a 3.3V LVDS high-speed differential driver and receiver designed for high-speed interconnects using Low Voltage Differential Signaling (LVDS) technology. It features a typical differential output swing of 350mV and a differential input threshold of 100mV, making it suitable for translating LVTTL signals to LVDS levels and vice versa. The device supports data rates greater than 400 Mbps, with a maximum differential pulse skew of 0.5ns and a maximum propagation delay of 2.5ns. The FIN1019M operates with low power dissipation and includes power-off protection, ensuring reliability in various conditions. It also incorporates fail-safe protection for open-circuit, shorted, and terminated conditions. The device is compliant with the TIA/EIA-644 LVDS standard and features a flow-through pinout that simplifies PCB layout. It is available in two package types: a 14-lead Small Outline Integrated Circuit (SOIC) and a 14-lead Thin Shrink Small Outline Package (TSSOP), both of which are designed to save space in applications.

Datasheet Summary
Powered by GS/AI

The FIN1019M is a 3.3V LVDS high-speed differential driver and receiver designed for high-speed interconnects using Low Voltage Differential Signaling (LVDS) technology. It features a typical differential output swing of 350mV and a differential input threshold of 100mV, making it suitable for translating LVTTL signals to LVDS levels and vice versa. The device supports data rates greater than 400 Mbps, with a maximum differential pulse skew of 0.5ns and a maximum propagation delay of 2.5ns. The FIN1019M operates with low power dissipation and includes power-off protection, ensuring reliability in various conditions. It also incorporates fail-safe protection for open-circuit, shorted, and terminated conditions. The device is compliant with the TIA/EIA-644 LVDS standard and features a flow-through pinout that simplifies PCB layout. It is available in two package types: a 14-lead Small Outline Integrated Circuit (SOIC) and a 14-lead Thin Shrink Small Outline Package (TSSOP), both of which are designed to save space in applications.

Suppliers

Company
Product
Description
Supplier Links
Drivers, Receivers, Transceivers - FIN1019M - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Drivers, Receivers, Transceivers
FIN1019M
Drivers, Receivers, Transceivers FIN1019M
1/1 Transceiver Full LVDS 14-SOIC

1/1 Transceiver Full LVDS 14-SOIC

Buy Now Datasheet
Drivers, Receivers, Transceivers - FIN1019M - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Drivers, Receivers, Transceivers
FIN1019M
Drivers, Receivers, Transceivers FIN1019M
1/1 Transceiver Full LVDS 14-SOIC

1/1 Transceiver Full LVDS 14-SOIC

Buy Now Datasheet
Integrated Circuits (ICs) - Interface - Drivers, Receivers, Transceivers - FIN1019M - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Interface - Drivers, Receivers, Transceivers
FIN1019M
Integrated Circuits (ICs) - Interface - Drivers, Receivers, Transceivers FIN1019M
IC TRANSCEIVER FULL 1/1 14SOIC

IC TRANSCEIVER FULL 1/1 14SOIC

Supplier's Site

Technical Specifications

  Quarktwin Technology Ltd. Shenzhen Shengyu Electronics Technology Limited
Product Category RF Transceivers RF Transceivers
Product Number FIN1019M FIN1019M
Product Name Drivers, Receivers, Transceivers Integrated Circuits (ICs) - Interface - Drivers, Receivers, Transceivers
Package Type Surface Mount; 14-SOIC (0.154\", 3.90mm Width)
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