Ohmite Manufacturing Co. Heat Sink; Thermal Resistance Ohmite DV-T263-101E

The Ohmite D Series Heat Sink (part number 67R4338) is designed specifically for TO-252, TO-263, and TO-268 semiconductor packages. It features a unique construction that combines tin-plated, solderable rods with an aluminum extruded body, which enhances thermal performance by reducing thermal resistance. This design eliminates the air gap and thermal bottleneck typically found in stamped aluminum heat sinks, resulting in improved heat dissipation. The heat sink is lightweight, facilitating faster assembly in manufacturing processes. It is available in bulk packaging or on tape and reel for automated handling, with 250 units per reel. The product is RoHS compliant, ensuring it meets environmental standards. The thermal performance is significantly enhanced, with up to 300% improvement over conventional stamped heat sinks, making it suitable for applications requiring efficient thermal management.