Ohmite D Series heatsinks provide an innovative solution for SMT compatible semiconductors and resistors. The unique design (Patent Pending) combines tin plated, solderable rods with an aluminum extruded heat sink body. These rods (or “rollers”) are mated mechanically to the heatsink by forging to reduce the thermal resistance between the heatsink body and the solderable feet.
Heat Sink TO-268 (D³Pak) Aluminum 7.0W @ 35°C Top Mount
Heat Sink TO-268 (D³Pak) Aluminum 7.0W @ 35°C Top Mount
Heat Sink TO-268 (D³Pak) Aluminum 7.0W @ 35°C Top Mount
HEAT SINK, ALUMINIUM, 40.2MM, TO-268; Thermal Resistance:-; Packages Cooled:TO-268; External Width - Metric:12.7mm; External Height - Metric:11.68mm; External Length - Metric:40.1mm; External Diameter - Metric:- RoHS Compliant: Yes
| Richardson RFPD | DigiKey | Newark, An Avnet Company | |
|---|---|---|---|
| Product Category | Heat Sinks | Heat Sinks | Heat Sinks |
| Product Number | DA-T268-301E-TR | 273-DA-T268-301E-TRDKR-ND | 88W4366 |
| Product Name | Board Level Heat Sink | Heat Sinks | Heat Sink, Aluminium, 40.2Mm, To-268; Thermal Resistance Ohmite |
| Device | Passive Heat Sink | ||
| Weight | 4.08 g (0.1440 oz) | ||
| Mounting | Solderable Feet | ||
| Thermal Resistance | 4 °C / W |
