NTE Electronics, Inc. Thermal Insulator; Insulator Body Material Nte Electronics NTE439

Description
THERMAL INSULATOR; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes
Datasheet
Description
THERMAL INSULATOR; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Insulator; Insulator Body Material Nte Electronics - 29C4596 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Insulator; Insulator Body Material Nte Electronics
29C4596
Thermal Insulator; Insulator Body Material Nte Electronics 29C4596
THERMAL INSULATOR; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes

THERMAL INSULATOR; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 29C4596
Product Name Thermal Insulator; Insulator Body Material Nte Electronics
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 410 F (0 to 210 C)
View Details
Thermal Pads - 607036 - RS Components, Ltd.
RS Components, Ltd.
Specs
Thermal Conductivity 15 W/m-K (8.67 BTU-ft/hr-ft²-F)
View Details
One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications - EP17HTND-CCM - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Die Bonding Adhesives; Flowable Paste; Grease, Paste
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details