NTE Electronics, Inc. Insulator Kit; Insulator Body Material Nte Electronics NTE422

Description
INSULATOR KIT; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes
Datasheet
Description
INSULATOR KIT; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Insulator Kit; Insulator Body Material Nte Electronics - 30C0292 - Newark, An Avnet Company
Chicago, IL, United States
Insulator Kit; Insulator Body Material Nte Electronics
30C0292
Insulator Kit; Insulator Body Material Nte Electronics 30C0292
INSULATOR KIT; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes

INSULATOR KIT; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:-; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 30C0292
Product Name Insulator Kit; Insulator Body Material Nte Electronics
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 410 F (0 to 210 C)
View Details
Thermal Pads - 9156060 - RS Components, Ltd.
RS Components, Ltd.
Specs
Chemical System Silicone
View Details
Die Attach Epoxy Featuring High Tg Meets NASA Low Outgassing Requirements - EP17HTDA-2 - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Chemical System Epoxy
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details