NIKKO Company Filled Via Circuit Substrates

Features A thick film circuit substrate with through hole vias filled with Silver based conductor material Capable of creating a thermal bypass to the back side as thermal vias when used for COB assemblies and SMT assemblies that require thermal dissipation Capable of creating Pad on Via for component electrodes, which make miniaturization and high density circuitry possible High reliability compared to through holes Capable of Via diameters as small as 0.1mm to large diameters, oval vias also available