120 A, logic level gate drive N-channel enhancement mode MOSFET in 175 °C LFPAK56 package, using advanced TrenchMOS Superjunction technology with optimization to provide improved EMC performance (up to 6 dB). This product has been designed and qualified for high performance power switching applications.
Features and benefits
Optimized for improved EMC Performance
120 A continuous ID(max) rating
Avalanche rated, 100% tested at IAS = 120 A
Strong SOA (linear-mode) rating
NextPowerS3 technology delivers 'superfast switching with soft body-diode recovery'
Low Qrr, QG and QGD for high system efficiency and low EMI designs
Schottky-Plus body-diode with low VSD, low Qrr, soft recovery and low IDSS leakage
Optimized for 4.5 V gate drive utilizing NextPowerS3 Superjunction technology
High reliability LFPAK (Power SO8) package, with copper-clip and solder die attach, qualified to 175 °C
Exposed leads can be wave soldered, visual solder joint inspection and high quality solder joints providing excellent board level reliability
Low parasitic inductance and resistance
Applications
Automation, control and instrumentation
Autonomous systems, Robotics and Cobots
DC-to-DC converters
Brushless DC motor control
Brushed motors
Battery isolation
Industrial load-switch and eFuse
Inrush management, hotswap
120 A, logic level gate drive N-channel enhancement mode MOSFET in 175 °C LFPAK56 package, using advanced TrenchMOS Superjunction technology with optimization to provide improved EMC performance (up to 6 dB). This product has been designed and qualified for high performance power switching applications.
Features and benefits
- Optimized for improved EMC Performance
- 120 A continuous ID(max) rating
- Avalanche rated, 100% tested at IAS = 120 A
- Strong SOA (linear-mode) rating
- NextPowerS3 technology delivers 'superfast switching with soft body-diode recovery'
- Low Qrr, QG and QGD for high system efficiency and low EMI designs
- Schottky-Plus body-diode with low VSD, low Qrr, soft recovery and low IDSS leakage
- Optimized for 4.5 V gate drive utilizing NextPowerS3 Superjunction technology
- High reliability LFPAK (Power SO8) package, with copper-clip and solder die attach, qualified to 175 °C
- Exposed leads can be wave soldered, visual solder joint inspection and high quality solder joints providing excellent board level reliability
- Low parasitic inductance and resistance
Applications
- Automation, control and instrumentation
- Autonomous systems, Robotics and Cobots
- DC-to-DC converters
- Brushless DC motor control
- Brushed motors
- Battery isolation
- Industrial load-switch and eFuse
- Inrush management, hotswap
