Murata Electronics Balun LDM182G4510CC001

Description
MULTI-LAY HYBRID BULUNS
  • Balun - LDM182G4510CC001 - ODG (Origin Data Global)
    ODG (Origin Data Global)
Request a Quote Datasheet
Description
MULTI-LAY HYBRID BULUNS
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Balun - LDM182G4510CC001 - ODG (Origin Data Global)
ODG (Origin Data Global)
Shenzhen, China
Balun
LDM182G4510CC001
Balun LDM182G4510CC001
MULTI-LAY HYBRID BULUNS

MULTI-LAY HYBRID BULUNS

Supplier's Site Datasheet
Shenzhen Shengyu Electronics Technology Limited
Futian, China
RF and Wireless - Balun
LDM182G4510CC001
RF and Wireless - Balun LDM182G4510CC001
MULTI-LAY HYBRID BULUNS

MULTI-LAY HYBRID BULUNS

Supplier's Site

Technical Specifications

  ODG (Origin Data Global) Shenzhen Shengyu Electronics Technology Limited
Product Category Network and Communication Chips Network and Communication Chips
Product Number LDM182G4510CC001 LDM182G4510CC001
Product Name Balun RF and Wireless - Balun
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