Home
Products & Services
Engineering News
Standards
Webinars
Newsletters
Engineering Forum
Products & Services
Products & Services
Engineering News
Standards Library
Reference Library
Engineering Forum
Search Products & Services
Search GlobalSpec
Expand GlobalSpec Website Search Form
Login
Sign Up
I forgot my password.
Don't have an account?
Register here.
Home
Products
Building and Construction
Data Acquisition and Signal Conditioning
Electrical and Electronics
Flow Control and Fluid Transfer
Fluid Power
Imaging and Video Equipment
Industrial and Engineering Software
Industrial Computers and Embedded Systems
Lab Equipment and Scientific Instruments
Manufacturing and Process Equipment
Material Handling and Packaging Equipment
Materials and Chemicals
Mechanical Components
Motion and Controls
Networking and Communication Equipment
Optical Components and Optics
Semiconductors
Sensors, Transducers and Detectors
Specialized Industrial Products
Test and Measurement Equipment
All Product Catalogs
Services
Building and Construction Services
Business Services
Calibration and Testing Services
Contract Manufacturing and Fabrication
Electrical and Electronic Contract Manufacturing
Engineering and Technical Services
Industrial Automation Services
Industrial Maintenance
Material Handling and Packaging Services
Specialized Industrial Services
Engineering News
Aerospace and Defense
Automotive
Building and Construction
Consumer
Electronics
Energy and Natural Resources
Environmental, Health and Safety
Food and Beverage
Life Sciences
Maritime
Materials and Chemicals
Supply Chain
Reference Library
Engineering Forum
Product Directory
Industrial Catalogs
Technical Articles
HOME
PRODUCTS & SERVICES
CATALOGS
NETWORK AND COMMUNICATION CHIPS
MURATA ELECTRONICS
LDB213G6010C-001 -- RF AND WIRELESS - BALUN
Murata Electronics
RF and Wireless - Balun
LDB213G6010C-001
Description
MULTI-LAY HYBRID BALUNS 0805
Description
MULTI-LAY HYBRID BALUNS 0805
Suppliers
Company
Product
Description
Supplier Links
Shenzhen Shengyu Electronics Technology Limited
Futian, China
RF and Wireless - Balun
LDB213G6010C-001
RF and Wireless - Balun
LDB213G6010C-001
MULTI-LAY HYBRID BALUNS 0805
MULTI-LAY HYBRID BALUNS 0805
Supplier's Site
Technical Specifications
Shenzhen Shengyu Electronics Technology Limited
Product Category
Network and Communication Chips
Product Number
LDB213G6010C-001
Product Name
RF and Wireless - Balun
Unlock Full Specs
to access all available technical data
Similar Products
KRYTAR, Inc.
Monopulse Comparators RFM005040
RFM005040
Specs
Device Type
Beamformers
Operating Frequency
500 to 4000 MHz
View Details
Skyworks Solutions, Inc.
Telecom
SI32176-B-FM1R
Specs
Supply Voltage
3.3V
Operating Temperature
0 to 70 C (32 to 158 F)
Package Type
42-WFQFN Exposed Pad
View Details
ArduSimple
Ethernet NTRIP Master
AS-XBEE-ETH-100-RJ45-00
Specs
Device Type
Receiver
Operating Temperature
-40 to 85 C (-40 to 185 F)
View Details
Rochester Electronics
Logic - Buffers, Drivers, Receivers, Transceivers
5962-8755601RA
Specs
Device Type
Transceiver
View Details
