Murata Electronics Balun LDB211G6005C-001

Description
MULTI-LAY HYBRID BALUNS 0805
Request a Quote Datasheet
Description
MULTI-LAY HYBRID BALUNS 0805
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
MULTI-LAY HYBRID BALUNS 0805

MULTI-LAY HYBRID BALUNS 0805

Supplier's Site Datasheet
RF and Wireless - Balun LDB211G6005C-001
MULTI-LAY HYBRID BALUNS 0805

MULTI-LAY HYBRID BALUNS 0805

Supplier's Site

Technical Specifications

  ODG (Origin Data Global) Shenzhen Shengyu Electronics Technology Limited
Product Category Network and Communication Chips Network and Communication Chips
Product Number LDB211G6005C-001 LDB211G6005C-001
Product Name Balun RF and Wireless - Balun
Unlock Full Specs
to access all available technical data

Similar Products

Modems - ICs and Modules - SI2494-A-GM-ND - DigiKey
Specs
Package Type 38-VFQFN Exposed Pad
Pins 38 #
View Details
Wireless Connectivity - AIROC™ Wi-Fi and Wi-Fi+Bluetooth® Combo - Wi-Fi 6/6E (802.11ax) - CYW55573 - CYW55573 - Infineon Technologies AG
Specs
Technology Bluetooth
Features RoHS
Operating Temperature -40 to 85 C (-40 to 185 F)
View Details