Murata Electronics RF and Wireless - Balun LDB181G8820C-110

Description
MULTI-LAY HYBRID BALUNS
Description
MULTI-LAY HYBRID BALUNS

Suppliers

Company
Product
Description
Supplier Links
Shenzhen Shengyu Electronics Technology Limited
Futian, China
RF and Wireless - Balun
LDB181G8820C-110
RF and Wireless - Balun LDB181G8820C-110
MULTI-LAY HYBRID BALUNS

MULTI-LAY HYBRID BALUNS

Supplier's Site

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited
Product Category Network and Communication Chips
Product Number LDB181G8820C-110
Product Name RF and Wireless - Balun
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