Infineon Technologies AG RF and Wireless - RF Front End (LNA + PA) BGM781N11E6327XUSA1

  • RF and Wireless - RF Front End (LNA + PA) - BGM781N11E6327XUSA1 - Shenzhen Shengyu Electronics Technology Limited
    Shenzhen Shengyu Electronics Technology Limited
Description
MODULE GPS FRONT-END TSNP-11-2
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
RF and Wireless - RF Front End (LNA + PA) - BGM781N11E6327XUSA1 - Shenzhen Shengyu Electronics Technology Limited
Shenzhen Shengyu Electronics Technology Limited
Futian, China
RF and Wireless - RF Front End (LNA + PA)
BGM781N11E6327XUSA1
RF and Wireless - RF Front End (LNA + PA) BGM781N11E6327XUSA1
MODULE GPS FRONT-END TSNP-11-2

MODULE GPS FRONT-END TSNP-11-2

Supplier's Site

Technical Specifications

  Shenzhen Shengyu Electronics Technology Limited
Product Category Network and Communication Chips
Product Number BGM781N11E6327XUSA1
Product Name RF and Wireless - RF Front End (LNA + PA)
Unlock Full Specs
to access all available technical data

Similar Products

- 1245561 - RS Components, Ltd.
RS Components, Ltd.
1245561
Specs
Technology Bluetooth
Interface USB; PCM, USB 2.0
Operating Temperature 60 C (140 F)
View Details
Logic - Buffers, Drivers, Receivers, Transceivers - 100126DC - Lingto Electronic Limited
Rochester Electronics
Logic - Buffers, Drivers, Receivers, Transceivers
100126DC
Specs
Device Type Transceiver
View Details
Logic - Buffers, Drivers, Receivers, Transceivers - 74LVC2G126DCURG4 - Lingto Electronic Limited
Texas Instruments
Logic - Buffers, Drivers, Receivers, Transceivers
74LVC2G126DCURG4
Specs
Device Type Transceiver
View Details
RF and Wireless - RF Switches - BGSX33MU16E6327XTSA1 - Shenzhen Shengyu Electronics Technology Limited
Infineon Technologies AG
RF and Wireless - RF Switches
BGSX33MU16E6327XTSA1
View Details