Murata Electronics Silicon Chip Capacitors (Wire bondable) 939113793522-T3N

Description
The BBSC series Silicon Capacitors target optical communication systems (ROSA /TOSA, SONET and all optoelectronics) as well as high speed data systems or products. These capacitors are designed for DC blocking, coupling and bypass grounding applications. The unique technology of integrated passive devices in silicon developed by Murata* offers low insertion loss, low reflection and high phase stability from 16 kHz up to 40 GHz for the BBSC. These deep trench silicon capacitors have been developed with a semiconductor MOS process. They provide very high reliability and capacitance stability over voltage (0.1% / V) and temperature (70 ppm / K). They have an extended operating temperature range from -55 to 150 C. Reliable and repeatable performances areobtained thanks to a fully controlled production line with high temperature curing (above 900 C) generating a highly pure oxide. The BBSC series is compliant with standard JEDEC assembly rules, making the product fully compatible with high speed automated pick-and-place manufacturing operations. These capacitors are RoHS-compliant and are available either with ENIG terminations or lead-free prebumping depending on the case size.
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Description
The BBSC series Silicon Capacitors target optical communication systems (ROSA /TOSA, SONET and all optoelectronics) as well as high speed data systems or products. These capacitors are designed for DC blocking, coupling and bypass grounding applications. The unique technology of integrated passive devices in silicon developed by Murata* offers low insertion loss, low reflection and high phase stability from 16 kHz up to 40 GHz for the BBSC. These deep trench silicon capacitors have been developed with a semiconductor MOS process. They provide very high reliability and capacitance stability over voltage (0.1% / V) and temperature (70 ppm / K). They have an extended operating temperature range from -55 to 150 C. Reliable and repeatable performances areobtained thanks to a fully controlled production line with high temperature curing (above 900 C) generating a highly pure oxide. The BBSC series is compliant with standard JEDEC assembly rules, making the product fully compatible with high speed automated pick-and-place manufacturing operations. These capacitors are RoHS-compliant and are available either with ENIG terminations or lead-free prebumping depending on the case size.
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Suppliers

Company
Product
Description
Supplier Links
Silicon Chip Capacitors (Wire bondable) - 939113793522-T3N - Richardson RFPD
Downers Grove, IL, United States
Silicon Chip Capacitors (Wire bondable)
939113793522-T3N
Silicon Chip Capacitors (Wire bondable) 939113793522-T3N
The BBSC series Silicon Capacitors target optical communication systems (ROSA /TOSA, SONET and all optoelectronics) as well as high speed data systems or products. These capacitors are designed for DC blocking, coupling and bypass grounding applications. The unique technology of integrated passive devices in silicon developed by Murata* offers low insertion loss, low reflection and high phase stability from 16 kHz up to 40 GHz for the BBSC. These deep trench silicon capacitors have been developed with a semiconductor MOS process. They provide very high reliability and capacitance stability over voltage (0.1% / V) and temperature (70 ppm / K). They have an extended operating temperature range from -55 to 150 C. Reliable and repeatable performances areobtained thanks to a fully controlled production line with high temperature curing (above 900 C) generating a highly pure oxide. The BBSC series is compliant with standard JEDEC assembly rules, making the product fully compatible with high speed automated pick-and-place manufacturing operations. These capacitors are RoHS-compliant and are available either with ENIG terminations or lead-free prebumping depending on the case size.

The BBSC series Silicon Capacitors target optical communication systems (ROSA /TOSA, SONET and all optoelectronics) as well as high speed data systems or products. These capacitors are designed for DC blocking, coupling and bypass grounding applications. The unique technology of integrated passive devices in silicon developed by Murata* offers low insertion loss, low reflection and high phase stability from 16 kHz up to 40 GHz for the BBSC. These deep trench silicon capacitors have been developed with a semiconductor MOS process. They provide very high reliability and capacitance stability over voltage (0.1% / V) and temperature (70 ppm / K). They have an extended operating temperature range from -55 to 150 C. Reliable and repeatable performances areobtained thanks to a fully controlled production line with high temperature curing (above 900 C) generating a highly pure oxide. The BBSC series is compliant with standard JEDEC assembly rules, making the product fully compatible with high speed automated pick-and-place manufacturing operations. These capacitors are RoHS-compliant and are available either with ENIG terminations or lead-free prebumping depending on the case size.

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Technical Specifications

  Richardson RFPD
Product Category Capacitors
Product Number 939113793522-T3N
Product Name Silicon Chip Capacitors (Wire bondable)
Configuration / Form Factor Chip Capacitor
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