Murata Electronics Silicon Chip Capacitors (Wire bondable) 935146521310-T3T

Description
The WLSC (100um thick) capacitors target RF High Power applications for wireless communication (e.g: 5G), radar and data broadcasting systems. The WLSC capacitors are suitable for DC decoupling, matching network, and harmonic / noise filtering functions. The unique technology of integrated passive devices in silicon developed by Murata*, can solve most of the problems encountered in demanding applications. These Si capacitors in ultra–deep trenches have been developed with a semiconductor process which enables the integration of high capacitance density from 6nF/mm2 to 250nF/mm2 (with a breakdown voltage of respectively 150V to 11V). Our SiCap technology features high reliability - up to 10 times better than alternative capacitors technologies - thanks to a full control of the production process with high temperature curing (above 900 C) generating a highly pure oxide. This technology provides industry-leading performance particularly in terms of capacitor stability over the full operating DC voltage & temperature range. In addition, intrinsic properties of the silicon show a low dielectric absorption and a low to zero piezo electric effect resulting in no memory effect. This Silicon based technology is ROHS compliant.
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Description
The WLSC (100um thick) capacitors target RF High Power applications for wireless communication (e.g: 5G), radar and data broadcasting systems. The WLSC capacitors are suitable for DC decoupling, matching network, and harmonic / noise filtering functions. The unique technology of integrated passive devices in silicon developed by Murata*, can solve most of the problems encountered in demanding applications. These Si capacitors in ultra–deep trenches have been developed with a semiconductor process which enables the integration of high capacitance density from 6nF/mm2 to 250nF/mm2 (with a breakdown voltage of respectively 150V to 11V). Our SiCap technology features high reliability - up to 10 times better than alternative capacitors technologies - thanks to a full control of the production process with high temperature curing (above 900 C) generating a highly pure oxide. This technology provides industry-leading performance particularly in terms of capacitor stability over the full operating DC voltage & temperature range. In addition, intrinsic properties of the silicon show a low dielectric absorption and a low to zero piezo electric effect resulting in no memory effect. This Silicon based technology is ROHS compliant.
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Suppliers

Company
Product
Description
Supplier Links
Silicon Chip Capacitors (Wire bondable) - 935146521310-T3T - Richardson RFPD
Downers Grove, IL, United States
Silicon Chip Capacitors (Wire bondable)
935146521310-T3T
Silicon Chip Capacitors (Wire bondable) 935146521310-T3T
The WLSC (100um thick) capacitors target RF High Power applications for wireless communication (e.g: 5G), radar and data broadcasting systems. The WLSC capacitors are suitable for DC decoupling, matching network, and harmonic / noise filtering functions. The unique technology of integrated passive devices in silicon developed by Murata*, can solve most of the problems encountered in demanding applications. These Si capacitors in ultra–deep trenches have been developed with a semiconductor process which enables the integration of high capacitance density from 6nF/mm2 to 250nF/mm2 (with a breakdown voltage of respectively 150V to 11V). Our SiCap technology features high reliability - up to 10 times better than alternative capacitors technologies - thanks to a full control of the production process with high temperature curing (above 900 C) generating a highly pure oxide. This technology provides industry-leading performance particularly in terms of capacitor stability over the full operating DC voltage & temperature range. In addition, intrinsic properties of the silicon show a low dielectric absorption and a low to zero piezo electric effect resulting in no memory effect. This Silicon based technology is ROHS compliant.

The WLSC (100um thick) capacitors target RF High Power applications for wireless communication (e.g: 5G), radar and data broadcasting systems. The WLSC capacitors are suitable for DC decoupling, matching network, and harmonic / noise filtering functions. The unique technology of integrated passive devices in silicon developed by Murata*, can solve most of the problems encountered in demanding applications. These Si capacitors in ultra–deep trenches have been developed with a semiconductor process which enables the integration of high capacitance density from 6nF/mm2 to 250nF/mm2 (with a breakdown voltage of respectively 150V to 11V). Our SiCap technology features high reliability - up to 10 times better than alternative capacitors technologies - thanks to a full control of the production process with high temperature curing (above 900 C) generating a highly pure oxide. This technology provides industry-leading performance particularly in terms of capacitor stability over the full operating DC voltage & temperature range. In addition, intrinsic properties of the silicon show a low dielectric absorption and a low to zero piezo electric effect resulting in no memory effect. This Silicon based technology is ROHS compliant.

Supplier's Site Datasheet
Silicon Capacitors - 935146521310-T3T - Lingto Electronic Limited
Shenzhen, China
Silicon Capacitors
935146521310-T3T
Silicon Capacitors 935146521310-T3T
CAP SILICON 100PF 15% 150V 0202

CAP SILICON 100PF 15% 150V 0202

Supplier's Site Datasheet

Technical Specifications

  Richardson RFPD Lingto Electronic Limited
Product Category Capacitors Capacitors
Product Number 935146521310-T3T 935146521310-T3T
Product Name Silicon Chip Capacitors (Wire bondable) Silicon Capacitors
Configuration / Form Factor Chip Capacitor
Capacitance Range 1.00E-4 microF 1.00E-4 microF
WVDC 68 volts
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