The Non-Silicone Thermal Pad, 200x3mm, is designed for effective thermal management in electronic applications. It features a thermal conductivity of 3W/mK and is suitable for high temperatures, operating within a range of -40°C to +125°C. The pad has a thickness of 3mm and includes a single side adhesive for easy application. It provides excellent material stability and electrical insulation, with a dielectric strength of 6kV/mm and a volume resistivity of 10^12 Ohm.cm. The pad is also compliant with RoHS standards and has a flame rating of V-0, indicating its suitability for various safety requirements.
NON-SILICONE THERMAL PAD, 200X3MM, GRY ROHS COMPLIANT: YES
| Newark, An Avnet Company | |
|---|---|
| Product Category | Thermal Compounds and Thermal Interface Materials |
| Product Number | 41AH5863 |
| Product Name | Non-Silicone Thermal Pad, 200X3Mm, Gry Rohs Compliant Multicomp Pro |
