multicomp PRO Non-Silicone Thermal Pad, 200X3Mm, Gry Rohs Compliant Multicomp Pro MPGCSP30NS-200-3.0

Description
NON-SILICONE THERMAL PAD, 200X3MM, GRY ROHS COMPLIANT: YES
Description
NON-SILICONE THERMAL PAD, 200X3MM, GRY ROHS COMPLIANT: YES
Datasheet
Datasheet Summary
Powered by GS/AI

The Non-Silicone Thermal Pad, 200x3mm, is designed for effective thermal management in electronic applications. It features a thermal conductivity of 3W/mK and is suitable for high temperatures, operating within a range of -40¬8C to +125¬8C. The pad has a thickness of 3mm and includes a single side adhesive for easy application. It provides excellent material stability and electrical insulation, with a dielectric strength of 6kV/mm and a volume resistivity of 10^12 Ohm.cm. The pad is also compliant with RoHS standards and has a flame rating of V-0, indicating its suitability for various safety requirements.

Datasheet Summary
Powered by GS/AI

The Non-Silicone Thermal Pad, 200x3mm, is designed for effective thermal management in electronic applications. It features a thermal conductivity of 3W/mK and is suitable for high temperatures, operating within a range of -40¬8C to +125¬8C. The pad has a thickness of 3mm and includes a single side adhesive for easy application. It provides excellent material stability and electrical insulation, with a dielectric strength of 6kV/mm and a volume resistivity of 10^12 Ohm.cm. The pad is also compliant with RoHS standards and has a flame rating of V-0, indicating its suitability for various safety requirements.

Suppliers

Company
Product
Description
Supplier Links
Non-Silicone Thermal Pad, 200X3Mm, Gry Rohs Compliant Multicomp Pro - 41AH5863 - Newark, An Avnet Company
Chicago, IL, United States
Non-Silicone Thermal Pad, 200X3Mm, Gry Rohs Compliant Multicomp Pro
41AH5863
Non-Silicone Thermal Pad, 200X3Mm, Gry Rohs Compliant Multicomp Pro 41AH5863
NON-SILICONE THERMAL PAD, 200X3MM, GRY ROHS COMPLIANT: YES

NON-SILICONE THERMAL PAD, 200X3MM, GRY ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5863
Product Name Non-Silicone Thermal Pad, 200X3Mm, Gry Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Two Component Epoxy Resin System Featuring Excellent Temperature And Chemical Resistance - EP62-1AO - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Grease, Paste
View Details
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Industry Automotive; Electronics
View Details
Thermal Grease - 1247690 - RS Components, Ltd.
RS Components, Ltd.
Specs
Form / Shape Grease, Paste
View Details
Highly Thermal Conductive, Electricity Insulative, Low Viscosity Type Silicone Compound - SARCON ® SPG-20A - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Chemical System Silicone
Industry Electronics; Semiconductors, IC's
View Details