multicomp PRO Non-Silicone Thermal Pad, 200X1.5Mm, Gry Rohs Compliant Multicomp Pro MPGCSP30NS-200-1.5

Description
NON-SILICONE THERMAL PAD, 200X1.5MM, GRY ROHS COMPLIANT: YES
Datasheet
Description
NON-SILICONE THERMAL PAD, 200X1.5MM, GRY ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Non-Silicone Thermal Pad, 200X1.5Mm, Gry Rohs Compliant Multicomp Pro - 41AH5861 - Newark, An Avnet Company
Chicago, IL, United States
Non-Silicone Thermal Pad, 200X1.5Mm, Gry Rohs Compliant Multicomp Pro
41AH5861
Non-Silicone Thermal Pad, 200X1.5Mm, Gry Rohs Compliant Multicomp Pro 41AH5861
NON-SILICONE THERMAL PAD, 200X1.5MM, GRY ROHS COMPLIANT: YES

NON-SILICONE THERMAL PAD, 200X1.5MM, GRY ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5861
Product Name Non-Silicone Thermal Pad, 200X1.5Mm, Gry Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - SnapTrace® - Thermon, Inc
Specs
Form / Shape 4ft Lengths; Gap Filler, Foam in Place Gasket
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
PU4500 Series Polyurethane Glue - PU4500-A-15AB - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Polyurethane
Industry Electronics
Use Temperature -40 to 185 F (-40 to 85 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details