multicomp PRO Non-Silicone Thermal Pad, 200X1Mm, Gry Rohs Compliant Multicomp Pro MPGCSP30NS-200-1.0

Description
NON-SILICONE THERMAL PAD, 200X1MM, GRY ROHS COMPLIANT: YES
Datasheet
Description
NON-SILICONE THERMAL PAD, 200X1MM, GRY ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Non-Silicone Thermal Pad, 200X1Mm, Gry Rohs Compliant Multicomp Pro - 41AH5860 - Newark, An Avnet Company
Chicago, IL, United States
Non-Silicone Thermal Pad, 200X1Mm, Gry Rohs Compliant Multicomp Pro
41AH5860
Non-Silicone Thermal Pad, 200X1Mm, Gry Rohs Compliant Multicomp Pro 41AH5860
NON-SILICONE THERMAL PAD, 200X1MM, GRY ROHS COMPLIANT: YES

NON-SILICONE THERMAL PAD, 200X1MM, GRY ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5860
Product Name Non-Silicone Thermal Pad, 200X1Mm, Gry Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Non-silicone thermal pad from the manufacturer suitable for smartphones - AF300 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Chemical System Silicone
Industry Electronics
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Industry Automotive; Electronics
View Details
Highly Thermal Conductive, Electricity Insulative, Low Viscosity Type Silicone Compound - SARCON ® SPG-20A - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Chemical System Silicone
Industry Electronics; Semiconductors, IC's
View Details