multicomp PRO Thermal Interface Putty W/emi, 55Ml, Gry; Thermal Conductivity Multicomp Pro MPGCS-ESP20-55ML

Description
THERMAL INTERFACE PUTTY W/EMI, 55ML, GRY; Thermal Conductivity:2W/m.K; Conductive Material:Silicone; Thickness:-; Thermal Impedance:-; Dielectric Strength:5kV/mm; External Length:-; External Width:-; Product Range:- RoHS Compliant: Yes
  • Thermal Interface Putty W/emi, 55Ml, Gry; Thermal Conductivity Multicomp Pro - 41AH5807 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL INTERFACE PUTTY W/EMI, 55ML, GRY; Thermal Conductivity:2W/m.K; Conductive Material:Silicone; Thickness:-; Thermal Impedance:-; Dielectric Strength:5kV/mm; External Length:-; External Width:-; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Putty W/emi, 55Ml, Gry; Thermal Conductivity Multicomp Pro - 41AH5807 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Putty W/emi, 55Ml, Gry; Thermal Conductivity Multicomp Pro
41AH5807
Thermal Interface Putty W/emi, 55Ml, Gry; Thermal Conductivity Multicomp Pro 41AH5807
THERMAL INTERFACE PUTTY W/EMI, 55ML, GRY; Thermal Conductivity:2W/m.K; Conductive Material:Silicone; Thickness:-; Thermal Impedance:-; Dielectric Strength:5kV/mm; External Length:-; External Width:-; Product Range:- RoHS Compliant: Yes

THERMAL INTERFACE PUTTY W/EMI, 55ML, GRY; Thermal Conductivity:2W/m.K; Conductive Material:Silicone; Thickness:-; Thermal Impedance:-; Dielectric Strength:5kV/mm; External Length:-; External Width:-; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5807
Product Name Thermal Interface Putty W/emi, 55Ml, Gry; Thermal Conductivity Multicomp Pro
Thermal Conductivity 2 W/m-K (1.16 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-85 - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
T-85
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 450 F (0 to 232 C)
View Details
Thermal Pads - 7074613 - RS Components, Ltd.
RS Components, Ltd.
Thermal Pads
7074613
View Details
One Part, Toughened Epoxy for Dam-and-Fill Encapsulation - Supreme 3DM-85 - Master Bond, Inc.
Master Bond, Inc.
One Part, Toughened Epoxy for Dam-and-Fill Encapsulation
Supreme 3DM-85
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Gap Filler, Foam in Place Gasket
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details