multicomp PRO Thermal Interface Putty W/emi, 55Ml, Gry; Thermal Conductivity Multicomp Pro MPGCS-ESP20-55ML

Description
THERMAL INTERFACE PUTTY W/EMI, 55ML, GRY; Thermal Conductivity:2W/m.K; Conductive Material:Silicone; Thickness:-; Thermal Impedance:-; Dielectric Strength:5kV/mm; External Length:-; External Width:-; Product Range:- RoHS Compliant: Yes
  • Thermal Interface Putty W/emi, 55Ml, Gry; Thermal Conductivity Multicomp Pro - 41AH5807 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL INTERFACE PUTTY W/EMI, 55ML, GRY; Thermal Conductivity:2W/m.K; Conductive Material:Silicone; Thickness:-; Thermal Impedance:-; Dielectric Strength:5kV/mm; External Length:-; External Width:-; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Interface Putty W/emi, 55Ml, Gry; Thermal Conductivity Multicomp Pro - 41AH5807 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Interface Putty W/emi, 55Ml, Gry; Thermal Conductivity Multicomp Pro
41AH5807
Thermal Interface Putty W/emi, 55Ml, Gry; Thermal Conductivity Multicomp Pro 41AH5807
THERMAL INTERFACE PUTTY W/EMI, 55ML, GRY; Thermal Conductivity:2W/m.K; Conductive Material:Silicone; Thickness:-; Thermal Impedance:-; Dielectric Strength:5kV/mm; External Length:-; External Width:-; Product Range:- RoHS Compliant: Yes

THERMAL INTERFACE PUTTY W/EMI, 55ML, GRY; Thermal Conductivity:2W/m.K; Conductive Material:Silicone; Thickness:-; Thermal Impedance:-; Dielectric Strength:5kV/mm; External Length:-; External Width:-; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5807
Product Name Thermal Interface Putty W/emi, 55Ml, Gry; Thermal Conductivity Multicomp Pro
Thermal Conductivity 2 W/m-K (1.16 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation - FLM36 - Master Bond, Inc.
Master Bond, Inc.
B-Staged Film Adhesive/Sealant Featuring Toughness, High Temperature Resistance, Thermal Conductivity and Electrical Isolation
FLM36
Specs
Type High Dielectric
Cure / Technology Thermoset
Form / Shape Pellets; Gap Filler, Foam in Place Gasket
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
NH Nonhardening
Specs
Cure / Technology Single Component
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 410 F (0 to 210 C)
View Details
RS Components, Ltd.
Thermal Pads
1624120
View Details