multicomp PRO Thermal Silicone Grease, Syringe, 30G; Dispensing Method Multicomp Pro MPGCS-027-SM5-30G

Description
THERMAL SILICONE GREASE, SYRINGE, 30G; Dispensing Method:Syringe; Volume:-; Weight:30g; Product Range:- RoHS Compliant: Yes
  • Thermal Silicone Grease, Syringe, 30G; Dispensing Method Multicomp Pro - 41AH5830 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL SILICONE GREASE, SYRINGE, 30G; Dispensing Method:Syringe; Volume:-; Weight:30g; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Silicone Grease, Syringe, 30G; Dispensing Method Multicomp Pro - 41AH5830 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Silicone Grease, Syringe, 30G; Dispensing Method Multicomp Pro
41AH5830
Thermal Silicone Grease, Syringe, 30G; Dispensing Method Multicomp Pro 41AH5830
THERMAL SILICONE GREASE, SYRINGE, 30G; Dispensing Method:Syringe; Volume:-; Weight:30g; Product Range:- RoHS Compliant: Yes

THERMAL SILICONE GREASE, SYRINGE, 30G; Dispensing Method:Syringe; Volume:-; Weight:30g; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5830
Product Name Thermal Silicone Grease, Syringe, 30G; Dispensing Method Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Silicone Free Form-in-Place Thermal Gap Filler - SARCON® SPG-25B-NS - Fujipoly® America Corp.
Fujipoly® America Corp.
Silicone Free Form-in-Place Thermal Gap Filler
SARCON® SPG-25B-NS
Specs
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Industry Electronics
Use Temperature -40 to 248 F (-40 to 120 C)
View Details
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D
746D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
High efficiency thermal pad for chipset - SF700 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
High efficiency thermal pad for chipset
SF700
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 302 F (-50 to 150 C)
View Details
Precision Camera Module Adhesive Solutions - ALPHA ® HiTech ® AD13-9692B - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Precision Camera Module Adhesive Solutions
ALPHA ® HiTech ® AD13-9692B
Specs
Type Optical
Cure / Technology Single Component
Form / Shape Liquid; Grease, Paste
View Details