multicomp PRO Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro MPGCS-020NS-200-0.5

Description
NON-SILICONE THERMAL PAD, 200X0.5MM, GRY ROHS COMPLIANT: YES
  • Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro - 41AH5819 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
NON-SILICONE THERMAL PAD, 200X0.5MM, GRY ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro - 41AH5819 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro
41AH5819
Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro 41AH5819
NON-SILICONE THERMAL PAD, 200X0.5MM, GRY ROHS COMPLIANT: YES

NON-SILICONE THERMAL PAD, 200X0.5MM, GRY ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5819
Product Name Non-Silicone Thermal Pad, 200X0.5Mm, Gry Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
CHT USA Inc.
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed
AS1707
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Industry Automotive; Electronics
View Details
Extremely Compressible Thermal Gap Filler - SARCON® PG45A - Fujipoly® America Corp.
Fujipoly® America Corp.
Extremely Compressible Thermal Gap Filler
SARCON® PG45A
Specs
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Gap Fill 0.0591 to 0.0984 inch (1.5 to 2.5 mm)
View Details
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D
746D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Heat Transfer Compound - T-99 - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
T-99
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details