multicomp PRO Adhesive Thermal Tape, 300Mm X 0.15Mm Rohs Compliant Multicomp Pro MPGCS-008T-300-0.15

Description
ADHESIVE THERMAL TAPE, 300MM X 0.15MM ROHS COMPLIANT: YES
Datasheet
Description
ADHESIVE THERMAL TAPE, 300MM X 0.15MM ROHS COMPLIANT: YES
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Adhesive Thermal Tape, 300Mm X 0.15Mm Rohs Compliant Multicomp Pro - 41AH5809 - Newark, An Avnet Company
Chicago, IL, United States
Adhesive Thermal Tape, 300Mm X 0.15Mm Rohs Compliant Multicomp Pro
41AH5809
Adhesive Thermal Tape, 300Mm X 0.15Mm Rohs Compliant Multicomp Pro 41AH5809
ADHESIVE THERMAL TAPE, 300MM X 0.15MM ROHS COMPLIANT: YES

ADHESIVE THERMAL TAPE, 300MM X 0.15MM ROHS COMPLIANT: YES

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41AH5809
Product Name Adhesive Thermal Tape, 300Mm X 0.15Mm Rohs Compliant Multicomp Pro
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - SnapTrace® - Thermon, Inc
Specs
Form / Shape 4ft Lengths; Gap Filler, Foam in Place Gasket
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance - EP30NS - Master Bond, Inc.
Specs
Type High Dielectric; Optical
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Liquid; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details